Advanced Packaging Fundamentals for Semiconductor Engineers
New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.
Chip Industry Week in Review
AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.
Chip Industry Week in Review
TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.
Three-Way Race To 3D-ICs
Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.
AI Agents Need Goals
AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when looking at the entire development flow.
2025: So Many Possibilities
This will be an incredible year for innovation, driven by AI and for AI, and pushing the limits of fundamental physics.
Signal Integrity Plays Increasingly Critical Role In Chiplet Design
Chiplet design engineers have complex new considerations compared to PCB concepts.
3D-IC For The Masses
Advanced assemblies have enabled an unprecedented rate of advancement in the data center, especially for neural processing, but can it expand beyond that?
Chiplets Add New Power Issues
Well-understood challenges become much more complicated when SoCs are disaggregated.
Chiplet Tradeoffs And Limitations
Multi-die assemblies offer more flexibility, but figuring out the right amount of customization can have a big impact on power, performance, and cost.
Chiplets: Where Are We Today?
The use of chiplet-based designs is expected to expand beyond high-performance parts to the broader market.
Implementing AI Activation Functions
Why flexibility, area, and performance are traded off in AI inferencing designs.
What Exactly Is Multi-Physics?
The chip industry's new buzzword comes with lots of implications and some vague definitions.
