Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 29 Oct, 2021 - Comments: 0

Automotive The automotive chip shortage is still affecting automotive OEMs. U.S. automakers Ford and GM reported lower 3rd quarter income year over year related to the chip shortage. They, as well as other automotive OEMs around the world, have had to temporarily shut assembly lines down when chips were not available. Infineon Technologies signed a memorandum of understanding with Hyundai M... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 09 Oct, 2020 - Comments: 0

Security A new certification program for hardware verification engineers from Edaptive Computing Inc (ECI) and OneSpin Solutions promises to help companies meet IC integrity standards for SoC designs for 5G, IoT, AI, automotive, industrial, defense, and avionics. These designs are often complex, with a variety of elements, such as programmable logic and different cores. The OneSpin Formal Veri... » read more

May’19 Startup Funding: Mega-Funding Rounds Continue

By Jeff Dorsch - 05 Jun, 2019 - Comments: 0

In May, 20 startups enjoyed the distinction of getting a mega-round of $100 million or more in private funding. Those 20 companies together took in more than $6.65 billion. There were two billion-dollar investments in recent weeks. GM Cruise, the autonomous vehicle startup, received $1.15 billion in new funding from General Motors, Honda Motor, the SoftBank Vision Fund, T. Rowe Price Asso... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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Week In Review: Auto, Security, Pervasive Computing

Week In Review: Auto, Security, Pervasive Computing

May’19 Startup Funding: Mega-Funding Rounds Continue