Week in Review: IoT, Security, Autos

By Jeff Dorsch - 26 Jul, 2019 - Comments: 0

Products/Services Siemens announced that Mazda Motor adopted the Capital electrical design software suite from Mentor, a Siemens Business, for the design of next-generation automotive electrical systems. Mazda is said to use Capital for model-based generative design for the electrical and electronic systems of the entire vehicle platform. Synopsys will host the 11th annual Codenomi-con USA ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 19 Jul, 2019 - Comments: 0

Products/Services Arm rolled out its Flexible Access program, which offers system-on-a-chip design teams the capability to try out the company’s semiconductor intellectual property, along with IP from Arm partners, before they commit to licensing IP and to pay only for what they use in production. The new engagement model is expected to prove useful for Internet of Things design projects and... » read more

Week in Review – IoT, Security, Auto

By Jeff Dorsch - 05 Jul, 2019 - Comments: 0

Products/Services Synopsys announced successful deployment of the Synopsys Yield Explorer yield learning platform for fast ramp-up of new products on Samsung's advanced finFET technology nodes. Using the secure data exchange mechanism in Yield Explorer, Samsung is able to share the data required for yield analysis, such as chip design, fab, and test, with its customers while maintaining the co... » read more

February ’19 Startup Funding: Big Cash Keeps Rolling In

By Jeff Dorsch - 07 Mar, 2019 - Comments: 0

Sixteen startups received private funding rounds of $100 million and up during February, including three that took in 10-figure rounds. Those 16 companies raised more than $8 billion in total. The SoftBank Vision Fund invested $1.5 billion in China's Chehaoduo, an online car trading group that includes Guazi.com, a used-car trading platform, and Maodou.com, which retails new sedans through d... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Health Catalyst

Week in Review: IoT, Security, Autos

Week in Review: IoT, Security, Auto

Week in Review – IoT, Security, Auto

February ’19 Startup Funding: Big Cash Keeps Rolling In