Manufacturing Bits: Dec. 19

By Mark LaPedus - 19 Dec, 2017 - Comments: 0

Superconducting magnet record The National High Magnetic Field Laboratory (MagLab) has broken another world record for magnets. With a superconducting magnet, MagLab reached a magnetic field of 32 teslas. This is a third stronger than the previous record and more than 3,000 times stronger than a refrigerator magnet, according to MagLab. Tesla, or T, is the measurement of magnetic field ... » read more

Manufacturing Bits: March 21

By Mark LaPedus - 21 Mar, 2017 - Comments: 0

Making harder windows Using cubic silicon nitride materials, a team of researchers have developed a harder window that can sustain severe conditions. There is a demand for harder and stronger windows in various applications, such as engines, ball bearings, cutting tools and other others. To enable this technology, researchers used materials based on transparent polycrystalline ceramics. One... » read more

Manufacturing Bits: Sept. 27

By Mark LaPedus - 27 Sep, 2016 - Comments: 0

X-ray movies Leveraging the concepts behind the paradox of Schroedinger’s cat, the Department of Energy’s SLAC National Accelerator Laboratory (SLAC) has made an X-ray movie of the internal workings of a molecule. Specifically, SLAC has taken time-resolved femtosecond x-ray diffraction patterns from a molecular iodine sample. Then, researchers created a movie of intramolecular motion wi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Helmholtz Association

Manufacturing Bits: Dec. 19

Manufacturing Bits: March 21

Manufacturing Bits: Sept. 27