Using ML In EDA

By Ed Sperling - 20 Sep, 2021 - Comments: 0

Machine learning is becoming essential for designing chips due to the growing volume of data stemming from increasing density and complexity. Nick Ni, director of product marketing for AI at Xilinx, examines why machine learning is gaining traction at advanced nodes, where it’s being used today and how it will be used in the future, how quality of results compare with and without ML, and what... » read more

Roadblocks For ML in EDA

By Brian Bailey - 28 Apr, 2021 - Comments: 1

Is EDA a suitable space for utilizing machine learning (ML)? The answer depends on a number of factors, including where exactly it is being applied, how much support there is from the industry, and whether there are demonstrable advantages. Exactly where ML will play a role has yet to be decided. Replacing existing heuristics with machine learning, for example, would require an industry-wide... » read more

SLX Multi-Objective Optimization (MOPT)

By Silexica - 24 Apr, 2019 - Comments: 0

Technologies such as autonomous cars and 5G communication are seeing a rapid increase in the number of processing elements (PE) per platform. Where software professionals were used to programming one, two or a handful of cores, the game has now changed. Intel’s Many Integrated Core Architecture [3] contains up to 78 cores, Nvidia Tegra XI[2] has up to 260 cores and Adapteva’s Epiphany-V[1] ... » read more

Tech Talk: Applying Machine Learning

By Ed Sperling - 08 Feb, 2018 - Comments: 0

Norman Chang, chief technologist at ANSYS, talks about real applications of machine learning for mechanical, fluid dynamics and chip-package-system design. https://youtu.be/MqYX0wbwSfE » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: heuristics

Using ML In EDA

Roadblocks For ML in EDA

SLX Multi-Objective Optimization (MOPT)

Tech Talk: Applying Machine Learning