Week In Review: Design, Low Power

By Jesse Allen - 09 Sep, 2022 - Comments: 0

Revenue for the top 10 IC design houses globally hit US$ 39.6 billion in 2Q22, a 32% growth over the prior year, according to a Trendforce report. The firm contends this growth trend will be difficult to maintain due to the high preceding base period and overall worse market conditions. Renesas introduced a RISC-V MCU specifically optimized for advanced motor control systems. The new ASSP in... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Jun, 2022 - Comments: 0

Tools, IP, chips Synopsys unveiled a new data-visibility and machine intelligence-guided design optimization solution. DesignDash is complementary to the company's DSO.ai AI-driven design-space-optimization tool and provides a real-time, unified, 360-degree view of all design activities. It uses deep analytics and machine learning to extract and reveal actionable understanding from large amoun... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Heyday Integrated Circuits

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Trending Articles

Shift Left Is The Tip Of The Iceberg

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

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HBM Options Increase As AI Demand Soars

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Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

NAND Flash Targets 1,000 Layers

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

New AI Processors Architectures Balance Speed With Efficiency

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tag: Heyday Integrated Circuits

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Trending Articles

Shift Left Is The Tip Of The Iceberg

NAND Flash Targets 1,000 Layers

One Chip Vs. Many Chiplets

FOPLP Gains Traction in Advanced Semiconductor Packaging

HBM Options Increase As AI Demand Soars

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

NAND Flash Targets 1,000 Layers

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

What Comes After HBM For Chiplets

Memory Fundamentals For Engineers

New AI Processors Architectures Balance Speed With Efficiency

Sponsors

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Knowledge Centers
Entities, people and technologies explored