The Week in Review: IoT

By Jeff Dorsch - 15 Jun, 2018 - Comments: 0

Tools/Chips Synopsys rolled out a new release of its automotive exterior lighting design and analysis software. The tool calculations and generates images for multiple viewing directions and different lighting conditions. Lighting on vehicles has become far more complex than just shining a beam on the road. The latest technology can adapt to road conditions, other cars, and help illuminate the... » read more

Security Improvements Ahead

By Ed Sperling - 10 Nov, 2015 - Comments: 0

After nearly two years of talking about how security is one of the biggest problems facing the IoE, progress is being made on a number of fronts. The changes involve many companies, both individually and collaboratively through standards groups. And while none of this will stop the kind of high-profile breaches that affected Target or Home Depot or JPMorgan Chase or a long list of other gian... » read more

The Next Level Of Chip Security

By Ernest Worthman - 09 Dec, 2014 - Comments: 0

As we move to that magic year, 2020, which is commonly being recognized as the year when the IoT is supposed to be in full bloom, the security issues just keep coming. The rate of cyber exploits continue to ramp up daily. Yet there seems to be just as much complacency about the [getkc id="76" comment="Internet of Things"] as there is about the Internet of today. It seems we are becoming desensi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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The Week in Review: IoT

Security Improvements Ahead

The Next Level Of Chip Security