Startup Funding: March 2023

By Jesse Allen - 05 Apr, 2023 - Comments: 0

Funding was broadly spread between sectors in March, with automotive edging ahead thanks to a more than $100 million round for a company manufacturing electric, autonomous heavy commercial trucks for freight logistics. To keep up with the amount of information presented by cars and ADAS, several companies raised funds for head-up displays with increasing levels of detail and expanded fields of ... » read more

Startup Funding: April 2022

By Jesse Allen - 04 May, 2022 - Comments: 0

Silicon photonics holds the potential to vastly increase bandwidth in chips and systems while reducing power use — and investors are taking note. In April, one of the largest funding rounds went to a startup developing chip-to-chip optical I/O. But that wasn't all. Photonics funding showed up in AI with a photonic Tensor core, in room-temperature quantum computing, and, of course, in lidar an... » read more

Startup Funding: June 2020

By Jesse Allen - 08 Jul, 2020 - Comments: 0

Two Chinese startups drew big investment as the country aims to become more semiconductor independent as trade restrictions continue. One company deals in wafers, packaging, and IC design, while the other is focused on AI chips. Quantum computing startups didn't see large investments this month, as most are still very young companies, but the number of them grew with a new university spin-out e... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Horizon Quantum Computing

Startup Funding: March 2023

Startup Funding: April 2022

Startup Funding: June 2020

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