Battle Looms Over Mobile Payments

By Ernest Worthman - 03 Mar, 2016 - Comments: 0

The lines are drawn. The sides are sizing each other up. Apple is on one side with secure element, and Google and Microsoft are on the other side with host card emulation. Both are mobile payment systems for smartphones that rely on near-field communication technology. Apple fired the first shot with SE, and Google soon replied with HCE. And now both sides are ramping up after months of dela... » read more

Scare Of The Month: Whitebox Cryptography

By Ernest Worthman - 03 Dec, 2015 - Comments: 0

A debate has been raging for some time about whether hardware is more secure than software. This story should provide plenty of fuel for debate. A few years ago, something called White Box Cryptography (WBC) was developed. This is a rather novel approach that attempts to implement cryptography algorithms in software, rather than hardware. The idea is to keep the cryptographic assets secure a... » read more

More Than Just Plastic

By Ernest Worthman - 06 Jul, 2015 - Comments: 0

The magnetic strip credit card era is coming to an end. The technology is antiquated, prone to security vulnerabilities, and has no self-destruct capability if lost or stolen. In its place are near-field technologies coupled with smart devices—think Apple Pay, Android Pay, Samsung Pay, digital wallets, MasterCard's PayPass—and now near-field communication (NFC) chips inside of cards. But... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: host-card emulation

Battle Looms Over Mobile Payments

Scare Of The Month: Whitebox Cryptography

More Than Just Plastic