What Exactly Are Chiplets And Heterogeneous Integration?
New technologies drive new terminology, but the early days for those new approaches can be very confusing.
Startup Funding: Q1 2025
AI chips and data center communications see big funding; 75 startups raise $2 billion.
Chip Industry Week In Review
Agentic AI chip design; $6.5B AI acquisition; IC energy consumption and emissions; US allies export controls; CPO switches; foundry and IC design house revenue reports; side-channel analysis library; 12-layer HBM4; 3D GAA utilizing 2D semis; EV charging in 5 minutes.
Big Changes Ahead For Interposers And Substrates
New materials and processes will help with power distribution and thermal dissipation in advanced packages.
Chip Industry Week In Review
Tariff questions, impact; global sales report; Europe's chiplets focus; DARPA's quantum push; Intel 18A enters risk production; optical networking bonanza; new wafer probe test; inference benchmark results; UMC opens 22nm fab in Singapore.
Global IC Fabs And Facilities Report: 2024
Companies poured billions into fabs and facilities around the world as regions continue to build self-sufficiency and form hubs with friendly nations.
Baby Steps Toward 3D DRAM
Stacking layers means a complete architecture rethink.
EUV’s Future Looks Even Brighter
Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.
Linear Pluggable Optics Save Energy In Data Centers
New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.
Chip Architectures Becoming Much More Complex With Chiplets
Options for how to build systems increase, but so do integration issues.
Startup Funding: Q4 2024
AI chips and interconnects end year on high note; $3 billion for 75 companies.
