Week in Review – IoT, Security, Autos

By Jeff Dorsch - 20 Sep, 2019 - Comments: 0

Products/Services Synopsys had a lot of announcements this week! Summer is definitely over. The company released BSIMM10 study, the latest version of the Building Security in Maturity Model, helping organizations plan, execute, mature, and measure their software security initiatives. It also released LucidShape version 2019.09, the latest version of that tool for the design, simulation, and an... » read more

The Week In Review: IoT

By Jeff Dorsch - 28 Oct, 2016 - Comments: 0

Security The Internet of Things was in the news this week, and not for good reasons. Unsecured IoT devices were implicated in the substantial distributed denial-of-service attack that severely affected popular websites on October 21. Well ahead of this event, ARM Holdings was planning to make IoT security its leading theme at this week’s ARM TechCon 2016 conference and exposition in Santa Cl... » read more

The Week In Review: IoT

By Jeff Dorsch - 16 Sep, 2016 - Comments: 0

Deals Verizon Communications agreed to acquire Sensity Systems of Sunnyvale, Calif., a supplier of energy-efficient light-emitting diode lighting equipment to serve as the foundation for its Internet of Things platform for smart cities; financial terms weren’t disclosed. The transaction is expected to close in the fourth quarter. Mike Lanman, Verizon’s senior vice president of Enterprise P... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Independent Security Evaluators

Week in Review – IoT, Security, Autos

The Week In Review: IoT

The Week In Review: IoT