Silicon Thermo-Optic Switches with Graphene Heaters Operating at Mid-Infrared Waveband

By Technical Paper Link - 30 Mar, 2022 - Comments: 0

Abstract "The mid-infrared (MIR, 2–20 μm) waveband is of great interest for integrated photonics in many applications such as on-chip spectroscopic chemical sensing, and optical communication. Thermo-optic switches are essential to large-scale integrated photonic circuits at MIR wavebands. However, current technologies require a thick cladding layer, high driving voltages or may introduce h... » read more

Making PUFs Even More Secure

By Bryon Moyer - 06 Jan, 2022 - Comments: 0

As security has become a must-have in most systems, hardware roots of trust (HRoTs) have started appearing in many chips. Critical to an HRoT is the ability to authenticate and to create keys – ideally from a reliable source that is unviewable and immutable. “We see hardware roots of trust deployed in two use models — providing a foundation to securely start a system, and enabling a se... » read more

Four-Period Vertically Stacked SiGe/Si Channel FinFET Fabrication and Its Electrical Characteristics

By Technical Paper Link - 28 Aug, 2021 - Comments: 0

Li Y, Zhao F, Cheng X, Liu H, Zan Y, Li J, Zhang Q, Wu Z, Luo J, Wang W. Four-Period Vertically Stacked SiGe/Si Channel FinFET Fabrication and Its Electrical Characteristics. Nanomaterials (Basel). 2021 Jun 28;11(7):1689. doi: 10.3390/nano11071689. PMID: 34203194; PMCID: PMC8307669. Find technical paper here. Abstract "In this paper, to solve the epitaxial thickness limit and the high in... » read more

A Machine-Learning-Resistant 3D PUF with 8-layer Stacking Vertical RRAM and 0.014% Bit Error Rate Using In-Cell Stabilization Scheme for IoT Security Applications

By Technical Paper Link - 03 Mar, 2021 - Comments: 0

Abstract: "In this work, we propose and demonstrate a multi-layer 3-dimensional (3D) vertical RRAM (VRRAM) PUF with in-cell stabilization scheme to improve both cost efficiency and reliability. An 8-layer VRRAM array was manufactured with excellent uniformity and good endurance of >10 7 . Apart from the variation in RRAM resistance, enhanced randomness is obtained thanks to the parasitic IR... » read more

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tag: Institute of Microelectronics of the Chinese Academy of Sciences

Silicon Thermo-Optic Switches with Graphene Heaters Operating at Mid-Infrared Waveband

Making PUFs Even More Secure

Four-Period Vertically Stacked SiGe/Si Channel FinFET Fabrication and Its Electrical Characteristics

A Machine-Learning-Resistant 3D PUF with 8-layer Stacking Vertical RRAM and 0.014% Bit Error Rate Using In-Cell Stabilization Scheme for IoT Security Applications

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tag: Institute of Microelectronics of the Chinese Academy of Sciences

Silicon Thermo-Optic Switches with Graphene Heaters Operating at Mid-Infrared Waveband

Making PUFs Even More Secure

Four-Period Vertically Stacked SiGe/Si Channel FinFET Fabrication and Its Electrical Characteristics

A Machine-Learning-Resistant 3D PUF with 8-layer Stacking Vertical RRAM and 0.014% Bit Error Rate Using In-Cell Stabilization Scheme for IoT Security Applications

Trending Articles

Shift Left Is The Tip Of The Iceberg

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers Entities, people and technologies explored

Related Articles

Shift Left Is The Tip Of The Iceberg

Partitioning In The Chiplet Era

3.5D: The Great Compromise

AI’s Role In Chip Design Widens, Drawing In New Startups

Key Technologies To Extend EUV To 14 Angstroms

Memory Fundamentals For Engineers

What Comes After HBM For Chiplets

Why Small Fab And Assembly Houses Are Thriving

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