tag: interface

Chip Industry Week In Review
By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Week In Review
By The SE Staff - 12 Jul, 2024 - Comments: 0

The U.S. Department of Commerce issued a notice of intent  to fund new R&D activities to establish and accelerate domestic advanced packaging capacity. CHIPS for America expects to award up to $1.6 billion in funding innovation across five R&D areas, as outlined in the vision for the National Advanced Packaging Manufacturing Program (NAPMP), with about $150 million per award in each... » read more

Chip Industry Week In Review
By The SE Staff - 03 Jul, 2024 - Comments: 0

Early version due to U.S. holiday. The U.S. government announced a new $504 million funding round for 12 Regional Technology and Innovation Hubs (Tech Hubs) for semiconductors, clean energy, biotechnology, AI, quantum computing, and more. Among the recipients: NY SMART I-Corridor Tech Hub (New York): $40 million for semiconductor manufacturing; Headwaters Hub (Montana): $41 million f... » read more

Chip Industry Week In Review
By The SE Staff - 28 Jun, 2024 - Comments: 0

The Design Automation Conference morphed into the Chips to Systems Conference, reflecting an industry shift from monolithic SoCs to assemblies of chiplets in various flavors of advanced packaging. The change drew a slew of students and a resurgent buzz, fueled by discussions about heterogeneous integration, reliability, and ways to leverage AI/ML to speed up design and verification processes. ... » read more

The I3C Interface Can Help Improve Performance In Sensor Applications
By Graeme Clark - 23 Mar, 2023 - Comments: 0

The I3C interface (officially the “MIPI Alliance Improved Inter Integrated Circuit”) was initially developed by the MIPI Alliance to support sensor interconnect in mobile applications. The MIPI Alliance is a global alliance of electronics companies that develop technical specifications for mobile applications, of which Renesas Electronics is a member. The original concept behind the I3C ... » read more

MIPI On Wheels: Enabling ADAS Applications
By Joseph Rodriguez - 11 Nov, 2021 - Comments: 0

Formed in 2003, the Mobile Industry Processor Interface (MIPI) Alliance brought together leading system and chip companies to provide standards for the essential video interface technologies for cameras and displays in phones. Over the years, the alliance has expanded its scope to publish specifications covering physical layer, multimedia, chip-to-chip and inter-processor communications (IPC), ... » read more

Meeting Fundamental Interface Requirements For Camera And Display With Integrated MIPI IP
By Licinio Sousa - 08 Apr, 2021 - Comments: 0

Cameras and displays are used in cars, industrial and medical devices, smartphones and other mobile devices, and machine vision applications. Over the years, the required data for high resolution videos and images have increased, forcing camera and display SoCs to process more complex visual data. The MIPI Alliance offers a portfolio of camera and display interfaces that deliver differentiation... » read more

PCIe 4.0 Hangs In, PCIe 5.0 Coming On Strong
By Mondeep Thiara - 17 Jan, 2019 - Comments: 0

First introduced in 2003 as a universal serial chip-to-chip interface running at 2.5 Gbps, PCI Express (Peripheral Component Interconnect Express), also known as PCIe, has advanced several revisions with significant improvements to performance and other features with each new generation. Through broad support, backwards compatibility, and a consistent cadence of upgrades that doubled lane sp... » read more

Surprises Abound As Subsystem IP Gains Prominence
By The SE Staff - 28 Feb, 2013 - Comments: 0

What’s new in the world of subsystem intellectual property? To find out, System-Level Design sat down with Richard Wawrzyniak, senior market analyst for ASICs and SoCs at Semico Research Corp. What follow are excerpts of that conversation. SLD: You mentioned that the cost of semiconductor intellectual property (IP) at 20nm and below is increasing. Why is that? Wawrzyniak: The reason is c... » read more

The Quest For Faster Data Throughput On A Chip
By Ed Sperling - 19 Feb, 2009 - Comments: 0

By Ed Sperling As with all network topologies, the general rule is the faster the better. Jack Browne, VP of sales and marketing at Sonics, said his customers are asking for higher-speed interconnects. “Right now we’re at 300MHz,” he said. “They want to more than double that in the very near future and eventually get to 1GHz.” Getting to that speed is no simple ... » read more

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