March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

The Week in Review: IoT

By Jeff Dorsch - 04 May, 2018 - Comments: 0

Cybersecurity Arm this week introduced the Cortex-M35P processor with anti-tampering technology and software isolation. The company also debuted security intellectual property to protect Internet of Things devices from physical cyberattacks and close proximity side-channel attacks. Paul Williamson, Arm’s vice president and general manager of the IoT Device IP line of business, provides more ... » read more

The Week In Review: IoT

By Jeff Dorsch - 24 Feb, 2017 - Comments: 0

M&A ARM Holdings this week announced the acquisition of two firms, Mistbase and NextG-Com, to help bring narrowband Internet of Things technology to its chip designs. In addition, the company announced the development of ARM Cordio-N radios to reduce the complexity of adopting cellular IoT connectivity. Meanwhile, Blu Wireless Technology of the U.K. reported that ARM made an equity investment ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Ionic Security

March’19 Startup Funding: Money Springs Forth

The Week in Review: IoT

The Week In Review: IoT