Week in Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 12 Aug, 2022 - Comments: 0

Automotive and Mobility Search engine giant Baidu said Monday it is the first company to secure permits to operate robotaxis in China without a human safety driver. Baidu’s Apollo and Toyota-backed Pony.ai already operate robotaxis with backup drivers in Beijing. Also this week, smartphone maker Xiaomi said it is running autonomous driving tests on 140 vehicles in China. Xiaomi announced it ... » read more

Week In Review: Manufacturing, Test

By Mark LaPedus - 30 Jul, 2021 - Comments: 0

Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Week in Review: IoT, Security, Auto

By Jeff Dorsch - 12 Oct, 2018 - Comments: 0

Deals Dialog Semiconductor made a blockbuster deal with Apple – the chip company will license power management technologies and transfer some assets to Apple, which will use them in their internal chip research and development. More than 300 Dialog employees, mostly engineers, will join Apple, which will pay $300 million in cash for the transaction and prepay another $300 million for Dialog ... » read more

New Robots For The IoT

By Ernest Worthman - 07 May, 2015 - Comments: 0

Until recently, remote telepresence has largely been a fixed screen with a video link between participants, and mostly in business setting. But all of that is about to change once the [getkc id="76" comment="Internet of Things"]/Internet of Everything begins to take root. There is a plethora of development going on in mobile robotic telepresence (MRT). Companies such as iRobot, Cisco, Suitab... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: iRobot

Week in Review: Auto, Security, Pervasive Computing

Week In Review: Manufacturing, Test

Week in Review: IoT, Security, Auto

New Robots For The IoT