Startup Funding: September 2021

By Jesse Allen - 04 Oct, 2021 - Comments: 0

Startups focused on data center chips had a big month in September. A new emergent from stealth promises to accelerate big data analytics, and startups proving CXL connectivity and high-performance RISC-V chiplets also drew funding. On the other end of the spectrum, NB-IoT and edge AI designers saw investment while a company providing on-chip monitoring can predict when chips will fail. Plus, c... » read more

Startup Funding: March 2020

By Jesse Allen - 08 Apr, 2020 - Comments: 0

Dedicated AI hardware, quantum computing, and avionics startups shined in March. Here's a look at seventeen startups, which raised a collective $525M. The avionics sector soared thanks to Lilium and its electric vertical takeoff jet. Quantum computing was another hot area, with three companies bringing in ~$88M together. Plus, chip design management, two companies developing AR glasses, and how... » read more

Startup Funding: February 2020

By Jesse Allen - 04 Mar, 2020 - Comments: 0

AI drew the biggest investments last month, with two AI hardware companies and one autonomous driving software startup pulling in nine-figure sums. Investors also pumped money into semiconductor manufacturing and test equipment, notably around EUV lithography and advanced packaging. AI Hardware SambaNova Systems received $250M in Series C funding for its software-defined hardware for AI, le... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ITIC

Startup Funding: September 2021

Startup Funding: March 2020

Startup Funding: February 2020

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