Startup Funding: January 2024

By Jesse Allen - 07 Feb, 2024 - Comments: 0

Big rounds marked January, with three companies raising over $100 million. Quantum computing topped the list, with the company that resulted from the merger of Cambridge Quantum Computing and Honeywell's quantum division raking in the third-largest round for a quantum computing company ever. Another chart-topper was an advanced packaging company that began mass production in its first factor... » read more

Startup Funding: July 2022

By Jesse Allen - 03 Aug, 2022 - Comments: 0

Quantum computing may seem like a futuristic technology, but computation based on superposition and entanglement is here and investors are eager to get behind it. Two of July's rounds that passed the $100 million mark were for superconducting quantum processor companies, one of which is also developing EDA software to assist in designing quantum circuits. And it's not just mega-rounds. Two quan... » read more

5G Test Equipment Race Begins

By Jeff Dorsch - 12 Jul, 2017 - Comments: 0

Test and measurement vendors stand ready to help with the development and deployment of 5G wireless communications, as the technology is fine-tuned and tested in trials around the world. Juniper Research forecasts 5G operator-billed service revenues will rise to $269 billion by 2025, compared with $851 million in 2019, for a compound annual growth rate of 161% during the first seven years of... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: KT Corp.

Startup Funding: January 2024

Startup Funding: July 2022

5G Test Equipment Race Begins