The Week In Review: Manufacturing


What was the mood at this week’s SPIE Litho? “EUV sentiment is improving among chipmakers as ASML makes progress toward HVM metrics; however, there is still much hedging around timing and readiness. We view EUV adoption as likely to be slow and gradual through 2020,” said Weston Twigg, an analyst with Pacific Crest Securities, in a report. “In order for ASML to hit the higher levels of ... » read more

The Week In Review: Manufacturing


Samsung plans to make a major entry into the drone market, according to reports. “Samsung is not alone in focusing on the drone market,” said Will Strauss, president of Forward Concepts, in a research note. “At CES next month in Las Vegas, one can expect new products from drone market leader DJI, but dozens of new drone models from Parrot and many other companies. Even GoPro chip maker A... » read more

The Week In Review: Manufacturing


For years, China has been trying to get a domestic IC equipment industry off the ground, but it has experienced modest success in the arena. Now, China may take a new strategy—acquire fab tool makers. In what could be a sign of things to come, China’s Beijing E-Town Dragon Semiconductor Industry Investment Center has entered into a definitive agreement to acquire U.S.-based fab tool vendor ... » read more

The Week In Review: Manufacturing


China is investing billions of dollars in the IC industry and equipment sectors. The nation is also in the midst of an acquisition and an investment spree, especially in IC packaging. For example, Jiangsu Changjiang Electronics Technology (JCET), a Chinese OSAT, shook up the landscape by recently announcing a deal to acquire STATS ChipPAC for $780 million. The deal was completed in August of 20... » read more

The Week In Review: Manufacturing


In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. "Lam Research and KLA-Tencor have been working to tie together process and process control in an effort to expand process windows and better enable complex production steps, like multi-patterning. This acquisition form... » read more

Lam To Acquire KLA-Tencor


In a major and surprising move in the fab tool business, Lam Research has entered into a definitive agreement to acquire KLA-Tencor for about $10.6 billion in cash and stock. Lam’s proposed move to acquire KLA-Tencor would create a powerhouse in the fab tool industry. The combined company will have approximately $8.7 billion in annual revenue, propelling it to become the world’s second l... » read more

The Week In Review: Manufacturing


According to Strategy Analytics, global mobile phone shipments grew a lackluster 2% annually to reach 435 million units in the second quarter of 2015. China’s Huawei was the star performer, as it captured a 7% share and overtook Microsoft to become the world’s third largest mobile phone vendor for the first time ever. Samsung remains in first place, while Apple is second. Remember when t... » read more

The Week In Review: Manufacturing


German laser giant Trumpf is spending more than 70 million euros ($76.9 million) to build a new facility for its laser amplifier technology in EUV lithography applications. Trumpf has nothing to do with the Republican presidential candidate Donald Trump. But rather Trumpf is a German-based supplier of machine tools, lasers and electronics for industrial applications. Meanwhile, Trumpf’s new b... » read more

The Week In Review: Manufacturing


Semicon West is always a busy week. Typically, there are a plethora of events going on during the week. It’s also a good week to get a pulse on the industry. The good news: Innovation is alive and well. Bad news: Intel cut its CapEx. And tool makers are in the midst of a lull right now, with a cloudy outlook projected for 2016. Some even see a dreaded downturn next year. Pacific Crest Secu... » read more

Dealing With Atoms


Chipmakers are ramping up a new range of device architectures, such as 3D NAND and finFETs. But to enable current and future devices, IC vendors will require new breakthroughs, including tools that can process tiny structures and films, even at the atomic level. The problem? There are gaps in terms of techniques that can process chips at the atomic level. Looking to help fill part of the ... » read more

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