Mixed Messages Complicate Mixed-Signal


Several years ago, analog and mixed signal (AMS) content hit a wall. Its contribution to first-time chip failure doubled, and there is no evidence that anything has improved dramatically since then. Some see that the problem is likely to get worse due to issues associated with advanced nodes, while others see hope for improvement coming from AI or chiplets. Fig. 1: Cause of ASIC respins. S... » read more

Facing Off Against Growing Chip Design Complexity


The semiconductor industry continues to face incredible pressures to deliver higher levels of performance in a smaller area, with lower power demands. From high-performance systems-on-chip for 5G mobile devices and network infrastructure to the radio-frequency transceivers that enable autonomous vehicles and the industrial Internet of Things, today’s applications demand a reduced profile, pai... » read more

Problems And Solutions In Analog Design


Advanced chip design is becoming a great equalizer for analog and digital at each new node. Analog IP has more digital circuitry, and digital designs are more susceptible to kinds of noise and signal disruption that have plagued analog designs for years. This is making the design, test and packaging of SoCs much more complicated. Analog components cause the most chip production test failures... » read more

The Rise Of Layout-Dependent Effects


By Ann Steffora Mutschler Designing for today’s advanced semiconductor manufacturing process nodes brings area, speed, power and other benefits but also new performance challenges as a result of the pure physics of running current through tiny wires. Layout-dependent effects (LDE), which emerged at 40nm and are having a larger impact at 28 and 20nm, introduce variability to circuit ... » read more