An Innovative Hybrid Cleaning Approach For Contaminant Removal in Semiconductor Packaging


The growing demand for power semiconductors, which control large currents and voltages, has resulted in their widespread use in various electronic devices, including electric vehicles (EVs). The requirement for greater performance and smaller devices has led to increased operating temperatures for these power semiconductors. This rise in temperature poses a challenge as it often leads to delami... » read more

Effect Of RF Plasma Process Gas Chemistry And Electrode Configuration On The Removal Of Copper Lead Frame Oxidation


By Daniel Chir and Johnson Toh Lead frame surface oxidation can lead to surface delamination after molding or wire bonding issues. The application of plasma treatment has been proven to be safe and effective solution to address these issues. However, the effectiveness of plasma treatment for removing oxide is dependent on the correct use of recipe parameters, gas chemistry and electrode conf... » read more