Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 10 Jun, 2022 - Comments: 0

Automotive, mobility Lightyear, an automotive company based in the Netherlands, announced its solar car, the Lightyear 0, which goes into production this year. The car has a Worldwide Harmonised Light Vehicle Test Procedure (WLTP) range of 625 kilometers/388 miles and can charge itself while driving or parked, using double curved solar arrays on its roof. The daily charging adds 70 kilometers/... » read more

Startup Funding: May 2021

By Jesse Allen - 02 Jun, 2021 - Comments: 0

Big investment poured into AI hardware companies this month, with a focus on edge applications. Companies are experimenting with different architectures, including analog-focused devices and those that are capable of withstanding the harsh conditions of space. IP and EDA startups in China also drew funding as the country tries to create a full chip design ecosystem. Plus, PCB assembly, photonic... » read more

Startup Funding: March 2021

By Jesse Allen - 07 Apr, 2021 - Comments: 0

Self-driving vehicles revved up investors in March, with two companies receiving over $200M apiece as they prepare for their systems to enter mass production. One focuses on software for passenger vehicles, while the other is looking to autonomous trucks. Both of the companies received investment from automakers, with China's largest carmaker SAIC joining each of the funding rounds. It was also... » read more

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Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

NAND Flash Targets 1,000 Layers

New techniques go beyond improved deposition and etching, but challenges stack up, too.

by Bryon Moyer

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

New AI Processors Architectures Balance Speed With Efficiency

Hot Chips 24: Large language models ratchet up pressure for sustainable computing and heterogeneous integration; data management becomes key differentiator.

by Ed Sperling

tag: Lightyear

Week In Review: Auto, Security, Pervasive Computing

Startup Funding: May 2021

Startup Funding: March 2021

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