Week in Review – IoT, Security, Autos

By Jeff Dorsch - 13 Sep, 2019 - Comments: 0

Products/Services Arm and Swift Navigation will collaborate on providing technology to developers of autonomous vehicles and connected cars. San Francisco-based Swift Navigation, which offers Global Navigation Satellite System positioning technology for AVs, is teaming with the chip design company to offer Swift’s solutions as an option on Arm-based platforms, the companies say. Swift’s St... » read more

Printed Cars, Smart Stints, Personal Breathalyzers

By Joanne Itow - 21 Nov, 2016 - Comments: 0

The MEMS and sensor market continues to be a hotbed for innovation, new opportunities and, as with most new frontiers, there are also some disparate views on market dynamics and strategies. All this was evident at the 2016 MSIG Executive Congress last week in Scottsdale, Arizona. First, I’ll cover the pioneering and fun subjects. In addition to the Technology Showcase demos and member pres... » read more

Week 52: It’s Show Time

By Anne Cirkel - 05 Jun, 2015 - Comments: 0

We made it. This is blog No. 52 on our joint journey to DAC. Part of me can’t believe that Monday I will be opening the 52nd Design Automation Conference. It’s been a roller-coaster year of ups and downs, and I know for sure that without my amazing peers on the DAC executive committee, the conference never would have come together. Thank you guys – you have been great to work with. Let’... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Local Motors

Week in Review – IoT, Security, Autos

Printed Cars, Smart Stints, Personal Breathalyzers

Week 52: It’s Show Time

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Knowledge Centers
Entities, people and technologies explored