Tobias Welp, software architect and engineering manager at OneSpin Solutions, explains how to ensure the RTL created by design engineers matches what shows up in an FPGA.
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Auto chiplet consortium; more nuke plants for AI; critical IC materials risk; TIMs; Foxconn in Mexico; ML in auto MCUs; 3nm PHY chiplet; chip health monitoring; AI test.
Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.
Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.
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