3D-Printed Logic Gates and Resettable Fuses, Via Material Extrusion (MIT)


A new technical paper titled "Semiconductor-free, monolithically 3D-printed logic gates and resettable fuses" was published by researchers at MIT. "This work reports the first active electronics fully 3D-printed via material extrusion, i.e. one of the most accessible and versatile additive manufacturing processes. The technology is proof-of-concept demonstrated through the implementation of ... » read more

Ultrafast Optical Chirality Logic Gates (Aalto University)


A technical paper titled "Chirality logic gates" was published by researchers at Aalto University (Finland), National Center for Nanoscience and Technology (Beijing), and University of Cambridge. Abstract (partial) "The ever-growing demand for faster and more efficient data transfer and processing has brought optical computation strategies to the forefront of research in next-generation com... » read more

Research on Wire Sweep of Integrated Circuit Packaging Based on Three-dimensional Flow Simulation


Abstract: "Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire sweep has become the main factor affecting the reliability of the product. Therefore, it is a great challenge to master wire sweep in IC packaging process. This paper takes Low Profile Fi... » read more