The Week In Review: IoT

By Jeff Dorsch - 29 Sep, 2017 - Comments: 0

Connectivity Sigfox this week held the first annual Sigfox World IoT Expo in Prague, Czech Republic, bringing together network operators, business partners, and industry professionals. The company announced a number of new services for its users, including the Admiral Ivory connectivity service, which promises to make any short-range wireless device into a long-range Internet of Things device,... » read more

The Week In Review: IoT

By Jeff Dorsch - 19 May, 2017 - Comments: 0

Conferences It’s been an action-packed week at Internet of Things World. The show was co-located at the Santa Clara Convention Center with the Connected & Autonomous Vehicles conference. There were lots of deals announced and many products or services debuted at IoT World, which has grown enormously in four years, from 700 attendees at its first event in Palo Alto, Calif., in 2014 to some 14... » read more

Power/Performance Bits: July 2

By Ed Sperling - 02 Jul, 2013 - Comments: 0

Using low-power Wi-Fi to track moving humans Based on a concept similar to radar and sonar imaging, researchers at MIT’s Computer Science and Artificial Intelligence Laboratory have created a system capable of seeing people through walls. Previous efforts to develop such a system have involved the use of expensive and bulky radar technology that uses a part of the electromagnetic spectrum on... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: low-power Wi-Fi

The Week In Review: IoT

The Week In Review: IoT

Power/Performance Bits: July 2

Trending Articles

Hybrid Bonding Makes Strides Toward Manufacturability

Americas Chip Funding Energizes Industry

Advanced Packaging Driving New Collaboration Across Supply Chain

Startup Funding: Q3 2024

Chiplets Make Progress Using Interconnects As Glue

Knowledge Centers
Entities, people and technologies explored