Week In Review: Design, Low Power

By Jesse Allen - 04 Dec, 2020 - Comments: 0

Xilinx acquired the assets of Falcon Computing Solutions, a provider of high-level synthesis (HLS) compiler optimization technology for hardware acceleration of software applications. The acquisition will be integrated into the Xilinx Vitis Unified Software Platform to automate hardware-aware optimizations of C++ applications with minimal hardware expertise. “Our compiler provides a high degr... » read more

Week In Review: Design, Low Power

By Jesse Allen - 02 Oct, 2020 - Comments: 0

Arteris IP will acquire the assets of Magillem Design Services, combining Arteris' NoC interconnect IP with Magillem's chip design and assembly environment. Magillem’s software products will continue to be offered separately from the Arteris interconnect IP offerings and the joined company will continue to execute on Magillem’s existing product and technology roadmaps. Substantially all Mag... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 02 Oct, 2020 - Comments: 0

Security Synopsys’ Cybersecurity Research Center disclosed that its research resulted in three Common Vulnerability and Exposures (CVE) advisories on wireless router chipsets that have partial authentication bypass vulnerabilities. The vulnerability lets an attacker send an unencrypted data frame through a WPA2-protected WLAN, which will may respond with an encrypted data frame that the atta... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Magillem Design Services

Week In Review: Design, Low Power

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing