Chemistry Working For Lithography: The Marangoni-Effect-Based Single Layer For Enhanced Planarization

By Brewer Science - 17 Nov, 2021 - Comments: 0

In the field of semiconductor manufacturing, there is still a continuous search for techniques to improve the Critical Dimension Uniformity (CDU) across the wafer. CDU improvement and general defectiveness reduction increase the industrial yield and guarantee high reliability standards. In the KrF Dual-Damascene module integration, at a lithographic level, deep trench planarization is mandatory... » read more

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

By Brewer Science - 19 Aug, 2021 - Comments: 0

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents variations from the via arrays to the open areas, which cause the variation of CDs: the swing effect. The planarization of a DD via-first process is reported. A dual-layer solution is used to demonst... » read more

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

By Brewer Science - 17 Feb, 2021 - Comments: 0

Super Planarizing Material For Trench And Via Arrays

By Brewer Science - 21 May, 2020 - Comments: 0

As device design scales and becomes more complex, fine control of patterning and transfer steps is integral. Planarization of deep trenches and via arrays has always been a challenge. Aspect ratios continue to increase while critical dimensions shrink, and typical trench fill schemes are no longer able to meet the fill and planarization requirements. Traditional design of spin-on carbon (SOC) m... » read more

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tag: Marangoni effect

Chemistry Working For Lithography: The Marangoni-Effect-Based Single Layer For Enhanced Planarization

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach

Super Planarizing Material For Trench And Via Arrays

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