Week in Review: IoT, Security, Auto

By Jeff Dorsch - 31 May, 2019 - Comments: 0

Internet of Things Paris-based Parrot Drones and five other companies were selected by the Pentagon’s Defense Innovation Unit and the U.S. Army to adapt off-the-shelf commercial drones for combat applications as part of the Army’s Short Range Reconnaissance program. SRR seeks to develop unmanned aerial vehicles that have a flight time of 30 minutes, a range of three kilometers (nearly two ... » read more

April’19 Startup Funding: Corporate Gushers

By Jeff Dorsch - 02 May, 2019 - Comments: 0

It was another rich month for startups, large and small. In April’s top 11 funding rounds, five were investments by big corporations or corporate venture capital funds—an investor consortium led by the SoftBank Vision Fund, PayPal, Ford Motor, NTT DoCoMo, and HAPSMobile, a joint venture of SoftBank Group and AeroVironment. Those 11 investments totaled $3.74 billion. Intel Capital was als... » read more

December ’18 Startup Funding: Big Rounds As 2018 Ends

By Jeff Dorsch - 03 Jan, 2019 - Comments: 0

During the month of December, 16 startups had private funding rounds of $100 million and up, with half of them in the mobility area. Those 16 rounds totaled $3.2 billion as the year concluded. Before the holidays, the SoftBank Vision Fund invested $500 million in Cambridge Mobile Telematics, provider of the DriveWell platform used by insurers, vehicle fleets, wireless carriers, and others to... » read more

The Week in Review: IoT

By Jeff Dorsch - 16 Mar, 2018 - Comments: 0

Cybersecurity The United Kingdom government issued a policy report, Secure by Design, calling on Internet of Things device manufacturers to eliminate default passwords, to provide greater transparency in vulnerability disclosure, and to secure credential storage. The report urges shifting cybersecurity responsibility to IoT device vendors, rather than end-users, and protecting the privacy righ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: MassMutual Ventures

Week in Review: IoT, Security, Auto

April’19 Startup Funding: Corporate Gushers

December ’18 Startup Funding: Big Rounds As 2018 Ends

The Week in Review: IoT

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Entities, people and technologies explored