tag: materials

Challenges Grow For Medical ICs
By Gregory Haley - 03 Mar, 2025 - Comments: 0

Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Research Bits: Feb. 18
By Jesse Allen - 18 Feb, 2025 - Comments: 0

Predicting band gap with neural networks Researchers from Kyoto University developed a machine learning model to predict the band gap of novel semiconductor materials. Using data from almost 2,000 semiconductor materials, the team tested six different neural networks. They found that the incorporation of conditional generative adversarial networks (CGAN) and message passing neural networks ... » read more

Innovations Driving The Advanced Packaging Roadmap: Part Two
By Keith Best - 11 Feb, 2025 - Comments: 0

As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume manufacturing. In last month’s blog, “Innovations Driving The Advanced Packaging Roadmap: Part One,” we discussed the challenges of organic and glass substrates as the industry marches toward sub-2µm ... » read more

Research Bits: Feb. 4
By Jesse Allen - 04 Feb, 2025 - Comments: 0

High-power diamond transistors Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for high-power electronics that remains switched off by default. The performance of the diamond was improved by coating it in hydrogen atoms followed by layers of aluminum oxide. “The challenge for power electronics is that the design of the... » read more

Upcoming Challenges And Changes In Semiconductor Materials
By Laura Peters And Ed Sperling - 23 Jan, 2025 - Comments: 0

Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent markets. What follows are excerpts of that conversation. SE: What was behind the decision to have co-CEOs instead of just one? Brewer: We see a lot of value to having multiple perspectives b... » read more

Navigating Increased Complexity In Advanced Packaging
By Gregory Haley - 17 Dec, 2024 - Comments: 1

As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything from process control and in-line metrology to materials selection and multi-level testing. These assemblies are the result of ... » read more

Monolithic Vs. Heterogeneous Integration
By Ed Sperling - 24 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what's needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Po... » read more

Five Questions To Ask When Selecting A Temporary Bonding And Debonding System
By Jessica Albright - 15 Aug, 2024 - Comments: 0

High-bandwidth memory blocks (HBM), microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play the most crucial role in device reliability and efficient production will ensure you are maximizing your yield, whi... » read more

Securing Supply Chains At SEMICON West 2024
By John Cooney - 15 Aug, 2024 - Comments: 0

Jose Fernandez, U.S. Under Secretary of State for Economic Growth, Energy, and the Environment, sat down with Joe Stockunas, President of SEMI Americas, for a fireside chat on the CEO Summit keynote stage at SEMICON West 2024. In the Securing Critical Supply Chains for the 21st Century discussion, Fernandez emphasized the need to form partnerships to address vulnerabilities as the key to cre... » read more

What Works Best For Chiplets
By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

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