Monolithic Vs. Heterogeneous Integration

By Ed Sperling - 24 Oct, 2024 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to discuss two very different paths forward for semiconductors and what's needed for each, with Jamie Schaeffer, vice president of product management at GlobalFoundries; Dechao Guo, director of advanced logic technology R&D at IBM; Dave Thompson, vice president at Intel; Mustafa Badaroglu, principal engineer at Qualcomm; and Thomas Po... » read more

Five Questions To Ask When Selecting A Temporary Bonding And Debonding System

By Jessica Albright - 15 Aug, 2024 - Comments: 0

High-bandwidth memory blocks (HBM), microprocessors, field-programmable gate arrays (FPGA), AI accelerators, and other devices used in advanced system-level packaging all rely on temporary bonding and debonding systems to shrink their footprint. Understanding which properties play the most crucial role in device reliability and efficient production will ensure you are maximizing your yield, whi... » read more

Securing Supply Chains At SEMICON West 2024

By John Cooney - 15 Aug, 2024 - Comments: 0

Jose Fernandez, U.S. Under Secretary of State for Economic Growth, Energy, and the Environment, sat down with Joe Stockunas, President of SEMI Americas, for a fireside chat on the CEO Summit keynote stage at SEMICON West 2024. In the Securing Critical Supply Chains for the 21st Century discussion, Fernandez emphasized the need to form partnerships to address vulnerabilities as the key to cre... » read more

What Works Best For Chiplets

By Anne Meixner - 18 Apr, 2024 - Comments: 0

The semiconductor industry is preparing for the migration from proprietary chiplet-based systems to a more open chiplet ecosystem, in which chiplets fabricated by different companies of various technologies and device nodes can be integrated in a single package with acceptable yield. To make this work as expected, the chip industry will have to solve a variety of well-documented technical an... » read more

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success

By Jessica Albright - 21 Sep, 2023 - Comments: 0

Semiconductors may be small, but the impacts they have are significant. Semiconductors used in life-dependent applications, such as pacemakers, defibrillators, life support systems, automotive safety systems, or in aviation need to be fail-proof. A device smaller than a centimeter with features just a few nanometers has no margin of error. This blog shares why it’s important to detect materia... » read more

High Performance, Energy-Dense, Practical, And Reliable Solid-State Batteries (ORNL)

By Technical Paper Link - 07 Jun, 2023 - Comments: 0

A technical paper titled “Tailoring of the Anti-Perovskite Solid Electrolytes at the Grain-Scale” was published by researchers at Oak Ridge National Laboratory. Abstract: "The development of thin, dense, defect-free solid electrolyte films is key for achieving practical and commercially viable solid-state batteries. Herein, we showcase a facile processing pathway for antiperovskite (Li2OH... » read more

Heterogeneous Integration Issues And Developments

By Ed Sperling - 14 Dec, 2022 - Comments: 0

There are a slew of new developments in advanced packaging, from new materials, chiplets, and interconnect schemes, to challenges involving how to physically put chips in a package, metallization, thermal cycling, and parasitics in the interconnect path. Dick Otte, CEO of Promex Industries, talks about how this will change chip design and manufacturing, and how those changes are likely to unfol... » read more

Variation Making Trouble In Advanced Packages

By Ed Sperling - 16 Jun, 2022 - Comments: 2

Variation is becoming increasingly problematic as chip designs become more heterogeneous and targeted by application, making it difficult to identify the root cause of problems or predict what can go wrong and when. Concerns about variation traditionally have been confined to the most advanced nodes, where transistor density is highest and where manufacturing processes are still being fine-t... » read more

Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)

By Brewer Science - 18 May, 2022 - Comments: 0

A thorough evaluation on selecting a bondable laser release material for redistribution layer (RDL)-first and die-first fan-out wafer-level packaging (FOWLP) is presented in this article. Four laser release materials were identified based on their absorption coefficient at 355 nm. In addition, all four of these materials possess thermal stability above 350 °C and pull-off adhesion on a Ti/Cu l... » read more

Big Changes In Materials And Processes For IC Manufacturing

By Ed Sperling And Laura Peters - 21 Apr, 2022 - Comments: 3

Rama Puligadda, CTO at Brewer Science, sat down with Semiconductor Engineering to talk about a broad set of changes in semiconductor manufacturing, packaging, and materials, and how that will affect reliability, processes, and equipment across the supply chain. SE: What role do sacrificial materials play in semiconductor manufacturing, and how is that changing at new process nodes? Puliga... » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: materials

Monolithic Vs. Heterogeneous Integration

Five Questions To Ask When Selecting A Temporary Bonding And Debonding System

Securing Supply Chains At SEMICON West 2024

What Works Best For Chiplets

5 Reasons Why Defect Reduction Is Critical In Semiconductor Material Success

High Performance, Energy-Dense, Practical, And Reliable Solid-State Batteries (ORNL)

Heterogeneous Integration Issues And Developments

Variation Making Trouble In Advanced Packages

Study Of Bondable Laser Release Material Using 355nm Energy To Facilitate RDL-First And Die-First Fan-Out Wafer-Level Packaging (FOWLP)

Big Changes In Materials And Processes For IC Manufacturing

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Knowledge Centers
Entities, people and technologies explored