Research Bits: June 9


InGaOx GAA transistor Researchers from the University of Tokyo created a gate-all-around transistor made from gallium-doped indium oxide (InGaOx). Doping indium oxide with gallium suppressed oxygen vacancies, improving transistor reliability. "We wanted our crystalline oxide transistor to feature a 'gate-all-around' structure, whereby the gate, which turns the current on or off, surrounds t... » read more

Research Bits: May 27


Tracking ferroelectric domain walls Researchers from Oak Ridge National Laboratory and National Cheng Kung University developed a technique called scanning oscillator piezoresponse force microscopy to observe how domain walls move in ferroelectric materials under rapidly fluctuating electric fields. “Domain walls can have completely different properties from the neighboring domains they s... » read more

Revolutionizing Semiconductor Development With GPU-Enhanced Atomistic Modeling


There are many challenges in the development of a modern semiconductor chip, from front-end architecture simulation to final signoff. Volume manufacturing has its own set of challenges, while silicon lifecycle management (SLM) extends into field deployment and aging concerns. Underlying this entire development flow, however, lie the materials used to build the actual chips. Guiding the explorat... » read more

Four Things Every Engineer Should Know About PFAS


What are PFAS chemicals? “PFAS” is an acronym for per- and polyfluoroalkyl substances. These man-made chemicals migrate into soil, water, and air when produced and used. There are many ways humans come in contact with PFAS, such as in non-stick cookware or cosmetics, but by far the most significant impact on human health is when PFAS is consumed in drinking water. Exposure to PFAS may resu... » read more

Challenges Grow For Medical ICs


Demand for medical ICs used inside and outside the body is growing rapidly, but unique manufacturing and functional requirements coupled with low volumes have turned this into a complex and extremely challenging market. Few semiconductor applications demand this level of precision, reliability, and long-term stability. Unlike consumer electronics, where failure might mean a reboot or chip re... » read more

Research Bits: Feb. 18


Predicting band gap with neural networks Researchers from Kyoto University developed a machine learning model to predict the band gap of novel semiconductor materials. Using data from almost 2,000 semiconductor materials, the team tested six different neural networks. They found that the incorporation of conditional generative adversarial networks (CGAN) and message passing neural networks ... » read more

Innovations Driving The Advanced Packaging Roadmap: Part Two


As the advanced packaging world enters the AI era, manufacturers are exploring ways to extend the life cycle of organic substrates and successfully introduce glass substrates to high volume manufacturing. In last month’s blog, “Innovations Driving The Advanced Packaging Roadmap: Part One,” we discussed the challenges of organic and glass substrates as the industry marches toward sub-2µm ... » read more

Research Bits: Feb. 4


High-power diamond transistors Researchers from the University of Glasgow, RMIT University, and Princeton University created a new diamond transistor for high-power electronics that remains switched off by default. The performance of the diamond was improved by coating it in hydrogen atoms followed by layers of aluminum oxide. “The challenge for power electronics is that the design of the... » read more

Upcoming Challenges And Changes In Semiconductor Materials


Semiconductor Engineering sat down with Dan Brewer and Srikanth Kommu, co-CEOs at Brewer Science, to talk about current and future changes in materials used in semiconductor manufacturing and adjacent markets. What follows are excerpts of that conversation. SE: What was behind the decision to have co-CEOs instead of just one? Brewer: We see a lot of value to having multiple perspectives b... » read more

Navigating Increased Complexity In Advanced Packaging


As chips evolve toward stacked, heterogeneous assemblies and adopt more complex materials, engineers are grappling with new and often less predictable sources of variation. This is redefining what it means to achieve precision, forcing companies to rethink everything from process control and in-line metrology to materials selection and multi-level testing. These assemblies are the result of ... » read more

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