Learning properties of ordered and disordered materials from multi-fidelity data


Source: Chen, C., Zuo, Y., Ye, W. et al. Learning properties of ordered and disordered materials from multi-fidelity data. Nat Comput Sci 1, 46–53 (2021). https://doi.org/10.1038/s43588-020-00002-x Abstract: "Predicting the properties of a material from the arrangement of its atoms is a fundamental goal in materials science. While machine learning has emerged in recent years as a n... » read more

More Data, More Memory-Scaling Problems


Memories of all types are facing pressures as demands grow for greater capacity, lower cost, faster speeds, and lower power to handle the onslaught of new data being generated daily. Whether it's well-established memory types or novel approaches, continued work is required to keep scaling moving forward as our need for memory grows at an accelerating pace. “Data is the new economy of this ... » read more

Si Hardmask (Si-HM), EUV And Zero Defects


The multilayer system used in lithography consists of a planarizing carbon layer beneath a hardmask etch-transferring layer and capped with a standard photoresist coating. In the past, Brewer Science has discussed in-depth how the multilayer system helped to extend ArF (193 nm) immersion lithography to be able to print and transfer ever-shrinking features, ensuring enough process window especia... » read more

Next Challenge: Parts Per Quadrillion


Requirements for purity of the materials used in semiconductor manufacturing are being pushed to unprecedented — and increasingly unprovable — levels as demand for reliability in chips over increasingly longer lifetimes continues to rise. And while this may seem like a remote problem for many parts of the supply chain, it can affect everything from availability of materials needed to make t... » read more

Advanced Materials For High-Temperature Process Integration


From the last several lithography nodes, in the 14 to 10nm range, to the latest nodes, in the 7 to 5nm range, the requirements for patterning and image transfer materials have increased dramatically. One of the key pinch points is the tradeoff between planarization and the high-temperature stability required from carbon films used in patterning and post-patterning process integration. Patter... » read more

Co-Design For The AI Era


Welcome to the second piece in our blog series examining how the computing industry can work in new ways to enable the AI Era. In our first blog, my colleague Ellie Yieh described the enormous opportunities and challenges facing the industry as we enter a new decade, and she offered a path for accelerating innovation—from materials to systems—based on a “New Playbook” for driving im... » read more

Silicon Carbide’s Superpowers


As we enter a new computing era driven by the Internet of Things (IoT), Big Data and Artificial Intelligence (AI), demand is growing for more energy-efficient chips. In this context, we usually think about Moore’s Law and reducing the size of transistors. However, advances in power semiconductors are not governed by node size reduction. Silicon power switches, such as MOSFETs and IGBTs, ar... » read more

System Bits: July 10


Light waves run on silicon-based chips Researchers at the University of Sydney’s Nano Institute and Singapore University of Technology and Design collaborated on manipulating light waves on silicon-based microchips to keep coherent data as it travels thousands of miles on fiber-optic cables. Such waves—whether a tsunami or a photonic packet of information—are known as solitons. The... » read more

Impact Of U.S.-China Trade War


The trade war between the United States and China is escalating and it is here to stay. Last year, the Trump administration started the trade war with China for basically two reasons. First, China has a massive trade surplus with the U.S. Second, U.S. companies have been the subject of IP theft in China, which has largely gone unchecked, according to the Trump administration. Many disagre... » read more

Multifunctional Materials Enable Single-Layer Temporary Bonding And Debonding


Many new wafer-level packaging (WLP) technologies involve the processing of thin wafers that must be mechanically supported during the manufacturing flow. These technologies include fan-out wafer-level packaging (FOWLP), fan-in wafer-level chip-scale packaging (FI-WLCSP), 3-D FOWLP, 2.5-D integration with interposer technology, and true 3-D IC integration using through-silicon via (TSV) interco... » read more

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