The Next Materials Race


Trade wars are costly on many fronts, and a trade war between the United States and China is bound to cause a variety of problems that no one anticipated. But in some areas, there may be a silver lining. And where there is no silver lining available, other materials may suffice. For decades, big chipmakers have been squeezing the entire semiconductor supply chain in a race to double the num... » read more

The Big Data Shift Has Started


Terry Brewer, president and CEO of Brewer Science, sat down with Semiconductor Engineering to talk about different priorities for private and public companies, why AI completely changes the game for technology companies, and what impact materials will have on innovation and design in the future. SE: What are the next big opportunities for Brewer Science? Brewer: There are broad opportunit... » read more

Looking For The Next Big Innovation


Never has there been more demand for “The Big Innovation” — one that moves the needle for performance, power and area-cost (PPAC) in a big way — as there is in the current era of AI and machine learning (ML). As summarized in Why AI Workloads Require New Computing Architectures, AI workloads require new architectures to process data. These workloads also call for heterogeneous comp... » read more

Variability In Chip Manufacturing


Brewer Science’s Jim Korich talks about how to deal with variability in processes and why consistency in materials is so important at advanced nodes. https://youtu.be/U1KkUmtmqpE » read more

Why Test Costs Will Increase


The economics of test are under siege. Long seen as a necessary but rather mundane step in ensuring chip quality, or a way of testing circuitry from the inside while it is still in use, manufacturers and design teams have paid little attention to this part of the design-through-manufacturing flow. But problems have been building for some time in three separate areas, and they could have a b... » read more

Solving Fan-Out Wafer-Level Warpage Challenges Using Material Science


Now more than ever we’re finding that semiconductor process engineers are turning to material scientists to help find solutions for their most complex challenges. Currently, they are looking for ways to improve fan-out wafer-level packaging (FOWLP), one of today’s hottest technologies for heterogeneous integration. Often, with these new advanced solutions come challenges that can impact ... » read more

The Materials Side Of AI


As we enter the foundry 7nm and below technology nodes, tungsten fill for contacts has reached the physical limits of scaling and copper used in the lowest level interconnects is facing challenges on multiple fronts. Solving these issues will require a new conducting material, namely cobalt. This transition can enable continued device scaling and less power consumption per computation. Follo... » read more

The Next Generation Of Fingerprinting Technology


We used to think of fingerprinting as simply placing your finger on an ink pad and then rolling it on paper to obtain an identifiable mark that would distinguish you from everyone else on the planet. In today’s world, fingerprinting has evolved to take on another, broader definition. According to dictionary.com, fingerprinting can also mean “any unique or distinctive pattern that presents u... » read more

The Role Of Cobalt In Enabling AI


We are on the cusp of the biggest computing wave yet — the AI era driven by Big Data. Enabling this era will require significant enhancements in processor performance and in the capacity and latency of memory. These requirements are coming at a time when the industry is being increasingly challenged by a slowdown in classic Moore’s Law scaling. What’s needed to continue driving the indust... » read more

Defect Reduction At 7/5nm


Darin Collins, director of metrology at Brewer Science, talks about the cause of defects at advanced nodes and how material purity increasingly plays a role in overall quality and yield. » read more

← Older posts