tag: MemryX

Chip Industry Week in Review

By The SE Staff - 09 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis. The U.S. government is rescinding a Biden-era AI export rule that would have imposed complex restrictions on how U.S. chip and AI technology is sold abroad, a move welcomed by companies like Nvidia, reports Bloomberg. While new, simpler guidelines are expected in the coming months, the decision introduces short-term uncer... » read more

Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Chip Industry Week In Review

By The SE Staff - 28 Mar, 2025 - Comments: 0

McKinsey issued a new report on the state of the chemical supply chain for semiconductors in the U.S., citing potential shortages of high-purity materials such as tungsten, aluminum and copper, lack of access to CMP slurries and photoresists for EUV, and rising competition for high-k precursors that can fetch higher prices outside of the U.S. CSIS weighed in on the U.S. goverment's recent ... » read more

Trending Articles

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Tape-Out Failures Are The Tip Of The Iceberg

As the success rate for the semiconductor industry declines, it may be time to rethink our priorities.

by Brian Bailey

Chip Industry Week in Review

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.

by The SE Staff

Chip Industry Week in Review

Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN sensor; IoT Wi-Fi 7; new e-beam lithography facility; more earning reports; Apple's 19B chips in U.S.

by The SE Staff

Knowledge Centers
Entities, people and technologies explored

Related Articles

Speeding Up Computational Lithography With The Power And Parallelism Of GPUs

A new lithography library brings mask optimization operations to GPUs.

by Thuc Dam

EUV’s Future Looks Even Brighter

Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.

by Gregory Haley

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

by Jesse Allen

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

by Bryon Moyer

Linear Pluggable Optics Save Energy In Data Centers

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

by Bryon Moyer

Chip Architectures Becoming Much More Complex With Chiplets

Options for how to build systems increase, but so do integration issues.

by Ed Sperling and Ann Mutschler

Interconnects Approach Tipping Point

The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.

by Laura Peters

About

Navigation

Connect With Us

Facebook
Twitter @semiEngineering
LinkedIn
YouTube

Copyright ©2013-2025 SMG | Terms of Service | Privacy Policy