Rethinking Processor Architectures

By Ed Sperling - 05 May, 2016 - Comments: 2

The semiconductor industry's obsession with clock speeds, cores and how many transistors fit on a piece of silicon may be nearing an end for real this time. The [getentity id="22048" comment="IEEE"] said it will develop the International Roadmap for Devices and Systems (IRDS), effectively setting the industry agenda for future silicon benchmarking and adding metrics that are relevant to specifi... » read more

A Low-Cost, Low Power Memory Solution For IoT Devices

By Kilopass - 04 Jun, 2015 - Comments: 0

The Internet of Things (IoT) connects everyday devices onto the Internet to gather information using sensors, embedded systems, and MEMS (micro-electrical mechanical systems). That information is then processed to increase efficiency or enable new services. With the proliferation of smartphones, tablets and laptops, industry estimates that there are currently more than five-billion devices ... » read more

The Week In Review: Design

By Ed Sperling - 03 Oct, 2014 - Comments: 0

IP ARM introduced a new software platform and a free operating system aimed at IoT development. The OS incorporates security, communication and device management features for improved energy efficiency. The device server simplifies the connection and management of devices, incorporating security and improving efficiency. Cadence rolled out a broad IP portfolio for TSMC's 16nm platform, and ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: micro controllers

Rethinking Processor Architectures

A Low-Cost, Low Power Memory Solution For IoT Devices

The Week In Review: Design