Chip Industry Week In Review


President Biden announced four new Workforce Hubs to support the CHIPS Act and other initiatives, in Upstate New York, Michigan, Milwaukee, and Philadelphia. The White House also provided economic context and progress updates for the President’s workforce strategy. Samsung began mass production of its ninth-gen industry-first V-NAND chip. Along with one-terabit triple-level cell design, th... » read more

Chip Industry Week In Review


SK hynix and TSMC plan to collaborate on HBM4 development and next-generation packaging technology, with plans to mass produce HBM4 chips in 2026. The agreement is an early indicator for just how competitive, and potentially lucrative, the HBM market is becoming. SK hynix said the collaboration will enable breakthroughs in memory performance with increased density of the memory controller at t... » read more

Chip Industry Week In Review


Applied Materials may scale back or cancel its $4 billion new Silicon Valley R&D facility in light of the U.S. government's recent announcement to reduce funding for construction, modernization, or expansion of semiconductor research and development (R&D) facilities in the United States, according to the San Francisco Chronicle. TSMC could receive up to $6.6 billion in direct funding... » read more

Chip Industry Technical Paper Roundup: Mar. 11


New technical papers added to Semiconductor Engineering’s library this week. [table id=205 /] More ReadingTechnical Paper Library home » read more

Chip Industry Week In Review


By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

The Benefits Of Curvilinear Full-Chip Inverse Lithography Technology With Mask-Wafer Co-Optimization 


A technical paper titled “Make the impossible possible: use variable-shaped beam mask writers and curvilinear full-chip inverse lithography technology for 193i contacts/vias with mask-wafer co-optimization” was published by researchers at D2S and Micron. Abstract: "Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patte... » read more

Make The Impossible Possible: Use Variable-Shaped Beam Mask Writers And Curvilinear Full-Chip Inverse Lithography Technology For 193i Contacts/Vias With Mask-Wafer Co-Optimization


Abstract: "Full-chip curvilinear inverse lithography technology (ILT) requires mask writers to write full reticle curvilinear mask patterns in a reasonable write time. We jointly study and present the benefits of a full-chip, curvilinear, stitchless ILT with mask-wafer co-optimization (MWCO) for variable-shaped beam (VSB) mask writers and validate its benefits on mask and wafer at Micron Tec... » read more

Why Chiplets Are So Critical In Automotive


Chiplets are gaining renewed attention in the automotive market, where increasing electrification and intense competition are forcing companies to accelerate their design and production schedules. Electrification has lit a fire under some of the biggest and best-known carmakers, which are struggling to remain competitive in the face of very short market windows and constantly changing requir... » read more

Money Pours Into New Fabs And Facilities


Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Industry Luminaries Highlight Opportunities For Advancing The Non-EUV Leading Edge


The eBeam Initiative’s 12th annual Luminaries survey in 2023 reported a range of nodes from >5nm to 14nm as the most advanced non-EUV nodes using 193i lithography. A panel of semiconductor photomask and lithography experts debated several of the survey results, including this one, to provide more insights behind the results. Aki Fujimura, CEO of D2S, Inc., the managing company sponsor of t... » read more

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