Week In Review: Design, Low Power

By Jesse Allen - 16 Jul, 2021 - Comments: 0

Tools Andes Technology certified Imperas reference models for the complete range of Andes IP cores with the new RISC-V P SIMD/DSP extension. The reference models can be used to evaluate multicore design configuration options for SoC architecture exploration and support early software development before silicon prototypes are available. Cadence's digital full flow was optimized and certified... » read more

Battle Brewing Over Automotive Display Protocols

By Bryon Moyer - 06 May, 2021 - Comments: 0

Displays are multiplying in new and future automobiles. That means a lot more display data moving around the vehicle and traveling some distance between sensor and processor. While existing protocols can handle some of the new duties, new protocols also are being developed specifically for this application. “Automotive displays are proliferating, increasing in numbers and in pixel densi... » read more

Car Industry Changing Under The Hood

By Ann Mutschler - 07 Jan, 2021 - Comments: 0

After an initial burst of autonomous activity, the automotive ecosystem regrouped, re-evaluated its goals, and is now ready to begin deploying new technologies made possible by modern development approaches and forward-looking vehicle architectures. The pandemic hurt vehicle sales in 2020, but it also gave the OEMs a chance to catch their breath. Panic over announcements from other carmakers... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Jun, 2020 - Comments: 1

Tools & IP Synopsys introduced its DesignWare USB4 IP solution consisting of controllers, routers, PHYs, and verification IP. It supports USB4, DisplayPort with HDCP 2.3 security, PCI Express, and Thunderbolt 3 connectivity protocols through USB Type-C connectors and cables. The USB4 IP operates at up to 40 Gbps, twice the maximum data rate of USB 3.2, and is backwards compatible with USB 3... » read more

How To Build An Automotive Chip

By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

Week In Review: Design, Low Power

By Jesse Allen - 03 Aug, 2018 - Comments: 0

Arm acquired Treasure Data, a provider of enterprise data management solutions. Along with Mbed Cloud and the recent acquisition of Stream, which provides connectivity and device management, it will form the basis of Arm's new IoT management platform. Treasure Data was founded in 2011. Terms of the deal were not disclosed, although Bloomberg reported the price at $600 million. UltraSoC n... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: MIPI A-PHY

Week In Review: Design, Low Power

Battle Brewing Over Automotive Display Protocols

Car Industry Changing Under The Hood

Week In Review: Design, Low Power

How To Build An Automotive Chip

Week In Review: Design, Low Power