Fine-Tuning Humanoid Vision And Movement


Key Takeaways: Humanoids and autonomous vehicles share a zonal architecture, a need for FuSa, and a reliance on radar technology to see around corners and through objects. Multiple cameras with different fidelities can better replicate a human’s field of view; for example, some can provide wide fields of view at low grade, low fidelity, while others strive for infinite fidelity in a... » read more

Chip Industry Week In Review


Dealmaking Amkor inked a 10-year agreement with TSMC to provide advanced packaging and test services in Arizona, tying TSMC’s U.S. fab expansion to domestic OSAT capacity. Trump said in a post that Apple will partner with Intel on chip design and production in the U.S., marking a second reported win for the chipmaker this month. Intel Foundry will also reportedly manufacture 3 million... » read more

Chip Industry Week In Review


U.S. Trade Representative Jamieson Greer warned Southeast Asian semiconductor manufacturers that they must shift production to the U.S. or face new punitive tariffs, reports the South China Morning Post. President Trump previously floated a 100% tariff on imported chips. Malaysia and other regional economies are offering large concessions and promises of U.S. goods purchases in hopes of securin... » read more

Chip Industry Week in Review


Apple plans to increase its U.S. investment by an additional $100 billion over four years, which includes the launch of an advanced manufacturing supply chain program, spurring a number of related chip industry announcements, including: Apple will invest in Amkor's new packaging and test facility in Arizona as its first and largest customer, and Amkor will package and test Apple silicon pr... » read more

Often Overlooked, PHYs Are Essential To High-Speed Data Movement


Over the past couple of decades, the semiconductor industry has evolved from a supporting role for traditional verticals like mobile, automotive, and PCs to a foundational role in those markets, as well as in AI factories and hyperscale data centers. Underlying this transformation is the physical layer (PHY), which has emerged as a critical enabler for data transfer and communications. The P... » read more

AI Pushes High-End Mobile From SoCs To Multi-Die


Advanced packaging is becoming a key differentiator for the high end of the mobile phone market, enabling higher performance, more flexibility, and faster time to market than systems on chip. Monolithic SoCs likely will remain the technology of choice for low-end and midrange mobile devices because of their form factor, proven record, and lower cost. But multi-die assemblies provide more fle... » read more

Chip Industry Week in Review


Check out the Inside Chips podcast for our behind-the-scenes analysis. The U.S. government is rescinding a Biden-era AI export rule that would have imposed complex restrictions on how U.S. chip and AI technology is sold abroad, a move welcomed by companies like Nvidia, reports Bloomberg. While new, simpler guidelines are expected in the coming months, the decision introduces short-term uncer... » read more

Chip Industry Week In Review


The new Trump administration was quick to put a different stamp on the tech world: President Trump rescinded a long list of Biden’s executive orders, including those aimed at AI safety and the mandate for 50% EVs by 2030. Roughly 1.3 million EVs were sold in the U.S. in 2024, up 7.3% from 2023. The new administration announced $500 billion ($100 billion initially) in private sector in... » read more

Chip Industry Week In Review


Siemens announced plans to acquire Altair Engineering, a provider of industrial simulation and analysis, data science, and high-performance computing (HPC) software, for about $10 billion. Altair's software will become part of Siemens' Xcelerator portfolio and provide a boost to physics-based digital twins. Onto Innovation bought Lumina Instruments, a San Jose, California-based maker of lase... » read more

Chip Industry Week In Review


Imec announced a new automotive chiplet consortium to evaluate which different architectures and packaging technologies are best for automotive applications. Initial members includes Arm, ASE, Cadence, Siemens, Synopsys, Bosch, BMW, Tenstorrent, Valeo, and SiliconAuto. Imec also launched star, a global network bringing together automotive and semiconductor innovators to address technological c... » read more

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