The Good And Bad Of Auto IC Updates

By John Koon - 03 Jun, 2021 - Comments: 0

Keeping automobiles updated enough to avoid problems is becoming increasingly difficult as more complex electronics are added into vehicles, and as the lifetimes of those devices are extended to a decade or more. Modern vehicles are full of electronics. In fact, the value of electronic devices used in modern vehicles is expected to double in the next 10 years, growing to $469 billion by 2030... » read more

Blog Review: May 1

By Jesse Allen - 01 May, 2019 - Comments: 0

Synopsys' Melissa Kirschner questions whether a unified standard for safety-related code development will be enough to secure connected cars as MISRA and AUTOSAR merge C++ guidelines. In a podcast, Mentor's Brent Klingforth and John McMillan share questions and answers about rigid-flex PCB design, including the value of incorporating flexible circuits and the key challenges faced when doing ... » read more

The Week in Review: IoT

By Jeff Dorsch - 10 Nov, 2017 - Comments: 0

Security Mocana said it is working with Avnet, Infineon Technologies, Microsoft, and Xilinx to provide Industrial Internet of Things systems that meet cybersecurity standards. The systems utilize the Avnet UltraZed-EG system-on-module, Mocana’s security software running on the Xilinx Zynq Ultrascale+ MPSoc, and Infineon’s OPTIGA Trusted Platform Module 2.0 security chip. The Microsoft Azur... » read more

The Week In Review: Design/IoT

By Jesse Allen - 26 Feb, 2016 - Comments: 0

Tools Synopsys incorporated automated analog and mixed-signal debug capabilities into its Verdi SoC debug platform, which now provides comprehensive hierarchical and schematic views of both the analog and digital portions of designs and automated tracing across analog and digital blocks. Mentor announced three applications for the Veloce emulation platform focused on overcoming unpredicta... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: MISRA

The Good And Bad Of Auto IC Updates

Blog Review: May 1

The Week in Review: IoT

The Week In Review: Design/IoT

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Knowledge Centers
Entities, people and technologies explored