tag: Mistral AI

Chip Industry Week In Review

By The SE Staff - 14 Feb, 2025 - Comments: 0

Worldwide silicon wafer shipments declined nearly 2.7% to 12,266 million square inches in 2024, with wafer revenue contracting 6.5% to $11.5 billion, according to the SEMI Silicon Manufacturers Group. CSIS released a new report, “Critical Minerals and the Future of the U.S. Economy,” with detailed analysis and policy recommendations for building a secure mineral supply chain for semicond... » read more

Chip Industry Week In Review

By The SE Staff - 08 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. Cadence plans to acquire BETA CAE Systems for $1.24 billion, the latest volley in a race to sell multi-physics simulation and analysis across a broad set of customers with deep pockets. Cadence said the deal opens the door to structural analysis for the automotive, aerospace, industrial, and health care sectors. Under the terms of the agreement, 6... » read more

Chip Industry Week In Review

By The SE Staff - 01 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. India approved the construction of two fabs and a packaging house, for a total investment of about $15.2 billion, according to multiple sources. One fab will be jointly owned by Tata and Taiwan's Powerchip. The second fab will be a joint investment between CG Power, Japan's Renesas Electronics, and Thailand's Stars Microelectronics. Tata will run t... » read more

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Demand for AI chips is growing exponentially, but costs and complexity limit the technology to a handful of companies. That could soon change.

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The 10 angstrom node will usher in new architectures, tooling, and materials, forcing a massive change in the way fabs build interconnects.

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Chip Industry Week In Review

Critical IC mineral concerns; wafer shipments shrink; Europe bets big on AI; new ultrasonic cleaner; high-speed DRAM test; Europe's 6G; HW-assisted verification; India IC grows; NPU acquisition; power spikes in AI workloads.

by The SE Staff

What’s Next In Advanced Packaging?

Momentum is building for organic interposers, 3D stacking, and photonics, but questions remain about how the industry gets there and what kinds of tradeoffs will be necessary.

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