Week In Review: Design, Low Power

By Jesse Allen - 25 Jan, 2019 - Comments: 0

M&A Ansys will acquire Helic, a provider of electromagnetic crosstalk analysis and signoff tools. Founded in 2000, Helic's tools included pre- and post-LVS EM modeling, inductor synthesis and modeling, and analysis of crosstalk risk. The company's technology will be integrated into a solution for on-chip, 3D integrated circuit and chip-package-system electromagnetics and noise analysis. Th... » read more

Tuning Heterogeneous SoCs

By Brian Bailey - 08 Dec, 2016 - Comments: 0

It's one thing to pack multiple processor cores into a design, but it is much more difficult to ensure the hardware matches the software's requirements, or that the software optimally uses the hardware. Both the hardware and software teams are now facing these issues, and there are few tools to help them fully understand the problems or to provide solutions. Design teams continue to add more... » read more

The Week In Review: Design/IoT

By Jesse Allen - 29 Jan, 2016 - Comments: 0

Mergers & Acquisitions Rambus expanded the scope of its Cryptography Research Division with the acquisition of UK-based Smart Card Software. The £64.7M ($91.84 million) deal comprises advanced mobile payment platform developer Bell ID as well as Ecebs, a supplier of smart ticketing systems to the UK transport markets. Tools & IP Mentor Graphics uncorked its Embedded Multicore ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Multicore Association

Week In Review: Design, Low Power

Tuning Heterogeneous SoCs

The Week In Review: Design/IoT