Week In Review: Design, Low Power

By Jesse Allen - 24 Sep, 2021 - Comments: 0

U.S. government officials met with semiconductor industry companies and automakers to request supply chain information it hopes could address the current semiconductor shortage, Reuters reports. Secretary of Commerce Gina Raimondo hopes the information will enable them and industry to "get more granular into the bottlenecks and then ultimately predict challenges before they happen," but also wa... » read more

Startup Funding: December 2020

By Jesse Allen - 06 Jan, 2021 - Comments: 1

AI hardware startups were hot in our December startup-funding focus, with two companies landing rounds exceeding $100M and plenty of others seeing investment. Two Chinese EDA companies received funding in a bid to boost the country's semiconductor ecosystem. One company providing control systems for fabs achieved $8M in Series A, and both autonomous driving and electric vehicles pulled in lots ... » read more

Power/Performance Bits: Aug. 18

By Jesse Allen - 18 Aug, 2020 - Comments: 0

Flexible, hole-filled films Researchers from Daegu Gyeongbuk Institute of Science and Technology (DGIST) and Hongik University propose a simple way to make flexible electrodes and thin film transistors last longer: adding lots of tiny holes. A major problem with flexible electronics is the formation of microscopic cracks after repeated bending which can cause the device to lose its conducti... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NEC Corporation

Week In Review: Design, Low Power

Startup Funding: December 2020

Power/Performance Bits: Aug. 18

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