Week In Review: Auto, Security, Pervasive Computing

By Marie C. Baca - 09 Sep, 2022 - Comments: 0

Automotive and mobility Seventeen U.S. states must decide whether or not to follow California's new law that mandates that all new cars, pickups and SUVs be electric or hydrogen-powered by 2035. The Clean Air Act dictates that states must follow federal guidelines unless they follow certain components of California's rules. A research firm says consumers are most passionate about a high-tec... » read more

Heart Of A Champion

By Judy Davies - 11 Jun, 2018 - Comments: 0

The National Football League’s (NFL) pre-season games begin on August 2. To many of us, players in the NFL represent the toughest of the tough, combining size, speed and strength. But before we invest all of our expendable income on the game-worn jerseys of rifle-armed quarterbacks or the next “megatron” wide receivers, consider the accomplishments of those NFL players who have excelled i... » read more

Are Consortia Fair Competition?

By Michael Watts - 11 Feb, 2014 - Comments: 2

This year’s Super Bowl was rather disappointing, but the NFL has been remarkably successful in creating an environment where all the teams have a path to success. This provides an interesting counter point to the discussion last time on the role of consortia such as IMEC. My point last time was that big problems require big solutions and cooperation between companies and even governments are... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: NFL

Week In Review: Auto, Security, Pervasive Computing

Heart Of A Champion

Are Consortia Fair Competition?