tag: Nikon

200mm Cools Off, But Not For Long
By Mark LaPedus - 18 Jul, 2019 - Comments: 4

After years of acute shortages, 200mm fab capacity is finally loosening up, but the supply/demand picture could soon change with several challenges on the horizon. 200mm fabs are older facilities with more mature processes, although they still churn out a multitude of today’s critical chips, such as analog, MEMS, RF and others. From 2016 to 2018, booming demand for these and other chips ca... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 12 Jul, 2019 - Comments: 0

Semi takeover targets Semiconductor M&A activity is heating up again. So who is next? “Within our coverage universe, we believe AMBA (Ambarella) and SLAB (Silicon Labs) represent the most likely targets moving forward,” according to KeyBanc in a research note. KeyBanc also listed some other “M&A Combinations That Could Make Sense.” Some of these combos make sense, while othe... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 28 Jun, 2019 - Comments: 0

Market research What’s the CapEx outlook for 2020? Semiconductor capital spending is down in 2019, but the industry faces another slump in 2020, according to IC Insights. The firm sees a 15% decline in CapEx for 2019 with a 5% drop expected in 2020. New 300mm fab construction in Korea is still going strong despite the memory downturn, according to SEMI. “Korea’s fab construction spen... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 03 May, 2019 - Comments: 0

Internet of Things AT&T reports the activation of its narrowband Internet of Things network in the U.S. The carrier upgraded its 4G LTE cell sites across the country. It now offers two low-power wide-area networks to business customers, including its LTE-M network in Mexico and the U.S. “Both networks are designed for the IoT within licensed spectrum and provide carrier-grade security,�... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 01 Mar, 2019 - Comments: 1

Trade Trade tensions between the United States and China continue. The U.S. last year slapped a 10% tariff on $200 billion worth of Chinese goods. China retaliated with a 10% tariff on $60 billion of U.S. imports. The U.S. said it wants to increase the tariffs on Chinese goods to 25%, but that action has been postponed. This was the week that the U.S. was supposed to raise tariffs by 25%. I... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 25 Jan, 2019 - Comments: 0

Chipmakers Shares of Intel fell amid lackluster results for the company, according to a report from CNBC. But Intel is also boosting its capital spending to $15.5 billion, according to the report. Here’s more on Intel from PC World. Meanwhile, Intel is expanding its research fab in Oregon, dubbed D1X, according to a report from The Oregonian. The company is in the process of building an ... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 04 Jan, 2019 - Comments: 0

Internet of Things The drone episode last month at Gatwick Airport in the United Kingdom forced the cancellation or diversion of more than 1,000 flights over three days. While local police arrested a couple suspected of being behind the drone flights, they were quickly exonerated and released. Questions remain on how airports should respond to such episodes, which are bound to happen again and... » read more

What Happened To Nanoimprint Litho?
By Mark LaPedus - 29 Mar, 2018 - Comments: 4

Nanoimprint lithography (NIL) is re-emerging amid an explosion of new applications in the market. Canon, EV Group, Nanonex, Suss and others continue to develop and ship NIL systems for a range of markets. NIL is different than conventional lithography and resembles a stamping process. Initially, a lithographic system forms a pattern on a template based on a pre-defined design. Then, a separa... » read more

Challenges For Future Fan-Outs
By Mark LaPedus - 07 Jul, 2017 - Comments: 1

The fan-out wafer-level packaging market is heating up. At the high end, for example, several packaging houses are developing new fan-out packages that could reach a new milestone and hit or break the magic 1µm line/space barrier. But the technology presents some challenges, as it may require more expensive process flows and equipment like lithography. Fig. 1: Redistribution layers. Source: L... » read more

The Week In Review: Manufacturing
By Mark LaPedus - 28 Apr, 2017 - Comments: 0

Chipmakers United Microelectronics Corp. (UMC) has expanded its process portfolio within its joint fab venture in China. The Taiwan government has approved UMC’s application to license its 28nm technology to its subsidiary company in China--United Semiconductor. The subsidiary has been ramping up 40nm technology. “This licensing approval will help Fab 12X to ramp its manufacturing scale, e... » read more

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