The Week In Review: IoT

By Jeff Dorsch - 16 Sep, 2016 - Comments: 0

Deals Verizon Communications agreed to acquire Sensity Systems of Sunnyvale, Calif., a supplier of energy-efficient light-emitting diode lighting equipment to serve as the foundation for its Internet of Things platform for smart cities; financial terms weren’t disclosed. The transaction is expected to close in the fourth quarter. Mike Lanman, Verizon’s senior vice president of Enterprise P... » read more

Using DNA Differently

By Ernest Worthman - 03 Dec, 2015 - Comments: 0

As the Internet of Everything creeps closer and closer, technologies from wireless to biometrics are undergoing metamorphosis. On the biometrics front, there is a vast array of applications, from fingerprints to facial recognition—even finger vein recognition. But the one that is garnering a lot of attention these days is DNA sequencing, and a subset called rapid DNA sequencing. Both are b... » read more

Security Made Easier

By Ernest Worthman - 08 Oct, 2015 - Comments: 0

The FIDO (Fast IDentity Online) Alliance was formed in July 2012 to address the lack of interoperability among strong authentication devices as well as the problems users face with creating and remembering multiple usernames and passwords. The FIDO Alliance’s mission is to change the landscape of authentication by eliminating the reliance on passwords. This is accomplished by developing speci... » read more

Cryptography For ULP Devices

By Ernest Worthman - 06 Aug, 2015 - Comments: 0

Soon virtually everything and everyone will be connected to the IoE in one fashion or another, and much of it will be wireless. To make it all work, these wireless, and low-power devices will need a new paradigm for handling cryptography. Ultra-low power devices have an interesting, and challenging set of metrics. There are, in general, two approaches that can work, with a variety of sub-sce... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Nok Nok Labs

The Week In Review: IoT

Using DNA Differently

Security Made Easier

Cryptography For ULP Devices