tag: Northeast Microelectronics Coalition

Chip Industry Week in Review

By The SE Staff - 25 Apr, 2025 - Comments: 0

To listen to the podcast version, click here. TSMC unveiled an unusually detailed roadmap at this week's North America Technology Symposium, including future architectures for 3D-ICs for high-performance computing and small, extremely low-power chips for AR/VR glasses, and two implementations of system-on-wafer. Fig. 1: TSMC's future packaging and stacking roadmap. Source: TSMC The ... » read more

Chip Industry Week In Review

By The SE Staff - 17 Jan, 2025 - Comments: 0

GlobalFoundries will create a new center for advanced packaging and testing of U.S.-made essential chips within its New York manufacturing facility. A flurry of announcements on advanced semiconductors and AI rolled out this week as U.S. President Biden wrapped up his term: The Biden-Harris Administration released an Interim Final Rule on Artificial Intelligence Diffusion to strengthen ... » read more

Startup Funding: Q4 2024

By Jesse Allen - 08 Jan, 2025 - Comments: 0

The fourth quarter of 2024 saw five mega-rounds of over $100 million. One of the hottest areas continues to be AI hardware, with one company developing RISC-V AI processor IP bringing in nearly $700 million in the largest round for a chip design startup this year. It was far from the only AI startup, however, as several companies gathered support for neuromorphic designs focused on ultra-low po... » read more

Trending Articles

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Chip Industry Week in Review

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.

by The SE Staff

AI Agents Need Goals

AI cannot optimize unless it can measure progress towards goals, but defining those goals is not easy, especially when looking at the entire development flow.

by Brian Bailey

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Chip Industry Week in Review

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