Chip Industry Week In Review

By The SE Staff - 26 Jul, 2024 - Comments: 0

The U.S. Department of Commerce and Amkor Technology signed a deal to provide up to $400 million in funding, under the CHIPS and Science Act, to build a previously announced end-to-end advanced packaging plant. The combined funding is expected to total about $2 billion. The new facility will add some 2,000 jobs in Peoria, Arizona. The SK hynix Board approved its Yongin Semiconductor Cluster... » read more

Chip Industry Week In Review

By The SE Staff - 07 Jun, 2024 - Comments: 0

Rapidus and IBM are jointly developing mass production capabilities for chiplet-based advanced packages. The collaboration builds on an existing agreement to develop 2nm process technology. Vanguard and NXP will jointly establish VisionPower Semiconductor Manufacturing Company (VSMC) in Singapore to build a $7.8 billion, 12-inch wafer plant. This is part of a global supply chain shift “Out... » read more

Chip Industry Week In Review

By The SE Staff - 24 May, 2024 - Comments: 0

Absolics, an affiliate of Korea materials company SKC, will receive up to $75 million in direct funding under the U.S. CHIPS Act for the construction of a 120,000 square-foot facility in Covington, Georgia, for glass substrates in advanced packaging. imec will host a €2.5 billion (~$2.72B) pilot line for researching chips beyond 2nm, partially funded through the EU Chips Act. imec CEO Luc ... » read more

Chip Industry Week In Review

By The SE Staff - 29 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. China introduced strict procurement guidelines aimed at blocking the use of AMD and Intel processors in government computers. Meanwhile, China urged the Netherlands to ease restrictions on deep ultraviolet (DUV) litho equipment, according to Nikkei Asia. DUV is an older technology, based on 193nm ArF lasers, but in conjunction with multi-p... » read more

Chip Industry Week In Review

By The SE Staff - 22 Mar, 2024 - Comments: 0

By Adam Kovac, Gregory Haley, and Liz Allan. The U.S. government released a 61-page report, titled "National Strategy on Microelectronics Research,” by the Subcommittee On Microelectronics Leadership. It provides a framework for government, industry, academia, and international allies to address four major goals. Synopsys acquired Intrinsic ID, which develops physical unclonable func... » read more

Chip Industry Week In Review

By The SE Staff - 15 Mar, 2024 - Comments: 0

By Adam Kovac, Karen Heyman, and Liz Allan. Europe's semiconductor footprint is growing in areas that previously had little association with chips. Silicon Box plans to build a panel-level foundry in northern Italy, funded in part by the Italian government. The deal is worth around €3.2 billion ($3.6B). In addition, imec will establish a specialized 300mm chip technology pilot line in M... » read more

Chip Industry Week In Review

By The SE Staff - 16 Feb, 2024 - Comments: 0

By Susan Rambo, Karen Heyman, and Liz Allan. Renesas plans to acquire Altium, maker of PCB design software, for $5.9 billion. In a conference call, Renesas CEO Hidetoshi Shibata cited Altium's PCB design software and digital twin virtual modeling as key components of its future strategy. "I believe it will generate transformational value for our combined customers and our stakeholders," Shib... » read more

Research Bits: September 19

By Jesse Allen - 19 Sep, 2023 - Comments: 0

Measuring lithography plasma sources Researchers from the University of Twente developed a tool that can measure the size of a plasma source and the color of the light it emits simultaneously, which they say could be used to improve lithography machines. “Traditionally, we could only look at the amount of light produced, but to further improve the chipmaking process, we also want to study... » read more

Research Bits: September 11

By Jesse Allen - 11 Sep, 2023 - Comments: 0

Combining digital and analog Researchers from École Polytechnique Fédérale de Lausanne (EPFL) propose integrating 2D semiconductors with ferroelectric materials for joint digital and analog information processing, which could improve energy efficiency and support new functionality. The device uses a 2D negative-capacitance tungsten diselenide/tin diselenide tunnel FET (TFET), which consu... » read more

Research Bits: Oct. 4

By Jesse Allen - 04 Oct, 2022 - Comments: 0

2D electrode for ultra-thin semiconductors Researchers from the Korea Institute of Science and Technology (KIST), Japan's National Institute for Materials Science, and Kunsan National University designed two-dimensional semiconductor-based electronic and logic devices, with electrical properties that can be selectively controlled through a new 2D electrode material, chlorine-doped tin diseleni... » read more

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Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Chip Industry Week In Review

Research Bits: September 19

Research Bits: September 11

Research Bits: Oct. 4

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