Week In Review: Manufacturing, Test

By Mark LaPedus - 12 Nov, 2021 - Comments: 0

Chipmakers AMD has rolled out its new MI200 series products, the first exascale-class GPU accelerators. Using a fan-out bridge packaging technology, the MI200 series are designed for high-performance computing (HPC) and artificial intelligence (AI) applications. The MI200 series accelerators feature a multi-die GPU architecture with 128GB of HBM2e memory. Typically, the HBM2e memory stack a... » read more

Week In Review: Design, Low Power

By Jesse Allen - 05 Nov, 2021 - Comments: 0

Business Synopsys acquired Concertio, a provider of AI-powered performance optimization software. The acquisition will bolster Synopsys' silicon lifecycle management platform SiliconMAX SLM with the addition of Concertio's autonomous software agent that, when installed on the target system, continuously monitors the interactions between operating applications and the underlying system enviro... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 05 Nov, 2021 - Comments: 0

Automotive The U.S. Department of Energy (DOE) is funding 25 cleaner car and truck projects with $199 million. Projects include long-haul trucks powered by batteries and fuel cells, and at improving the nation’s electric vehicle (EV) charging infrastructure. The Volvo Group North America (VGNA) will receive $18 million in federal funds under DOE’s SuperTruck 3 Program. Daimler Trucks N... » read more

Startup Funding: May 2021

By Jesse Allen - 02 Jun, 2021 - Comments: 0

Big investment poured into AI hardware companies this month, with a focus on edge applications. Companies are experimenting with different architectures, including analog-focused devices and those that are capable of withstanding the harsh conditions of space. IP and EDA startups in China also drew funding as the country tries to create a full chip design ecosystem. Plus, PCB assembly, photonic... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Oculii

Week In Review: Manufacturing, Test

Week In Review: Design, Low Power

Week In Review: Auto, Security, Pervasive Computing

Startup Funding: May 2021