Startup Funding: July 2023

By Jesse Allen - 02 Aug, 2023 - Comments: 0

Investors pumped more than $2.8 billion into 123 companies July. It was a particularly strong month for photonics companies, with a photonic integrated circuit foundry raising more than $100 million. Startups this month also are using photonic technology in innovative ways. This includes an all-optical RISC processor, biomarker identification, faster fully homomorphic encryption, and more AI... » read more

Startup Funding: April 2023

By Jesse Allen - 03 May, 2023 - Comments: 0

Packaging was a hot spot in April, with one of the largest rounds going to a middle-end-of-line advanced packaging company. A second packaging company also drew significant funding for its focus on wafer-level packaging for CMOS image sensors. Two packaging substrate manufacturers also saw investment. Two photoresist makers also drew sizeable rounds. Both they and the packaging companies are... » read more

Startup Funding: December 2021

By Jesse Allen - 04 Jan, 2022 - Comments: 0

Chinese startups dominated last month's fundraising, with companies from the country comprising about two-thirds of those covered in this report. In addition to the number of companies, startups from China also drew significant amounts of funding, with a display driver company and an EV battery maker each garnering around $1B and six more companies seeing rounds over $100M. Two particularly ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Orient Jiafu Asset Management

Startup Funding: July 2023

Startup Funding: April 2023

Startup Funding: December 2021