Americas Chip Funding Energizes Industry

By Liz Allan - 23 Oct, 2024 - Comments: 0

This is the second in a series of articles tracking government chip investments. See part one here (global), part 3 covering EMEA is here and Asia here. Since the first announcement of a non-binding preliminary memorandum of terms with BAE Systems in December 2023, the U.S. Department of Commerce has rolled out comprehensive plans to support more than a dozen companies in order to shore up... » read more

Manufacturing Bits: July 31

By Mark LaPedus - 31 Jul, 2018 - Comments: 0

Florida R&D fab A new microelectronics R&D initiative in Florida is expanding its operations and readying its new 200mm fab facility. The initiative, called BRIDG, describes itself as a non-profit, public-private partnership. BRIDG is basically an R&D microelectronics facility, which is focusing on the development of select technologies, such as photonics, sensors, imagers and 2.5D/3D pac... » read more

The Week In Review: Manufacturing

By Mark LaPedus - 08 Jul, 2016 - Comments: 2

Fab materials/tools The Reference Project, a pan-European research program created to develop radio-frequency silicon-on-insulator (RF-SOI) technology, was recently launched at the Bernin, France-based facilities of Soitec. Soitec is the project leader in the group, which has an eligible budget of 33 million euros. The project will focus on developing technologies for 4G+ communications usi... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Osceola County

Americas Chip Funding Energizes Industry

Manufacturing Bits: July 31

The Week In Review: Manufacturing