Reliability Performance Of S-Connect Module (Bridge Technology) For Heterogeneous Integration Packaging


With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of high-performance computing (HPC) applications is growing rapidly [2]. And, the HPC market requires high processing speed, fast network clusters and large parallel computing. To meet the market requirement... » read more