Startup Funding: July 2022

By Jesse Allen - 03 Aug, 2022 - Comments: 0

Quantum computing may seem like a futuristic technology, but computation based on superposition and entanglement is here and investors are eager to get behind it. Two of July's rounds that passed the $100 million mark were for superconducting quantum processor companies, one of which is also developing EDA software to assist in designing quantum circuits. And it's not just mega-rounds. Two quan... » read more

Startup Funding: June 2021

By Jesse Allen - 07 Jul, 2021 - Comments: 0

June was the month of mega-rounds for autonomous driving companies, with three pulling in well over $100M. All three are based in China, but their products range from chips to full robotaxi services. Also in the automotive space, an EV battery manufacturer raised over $2B, a solid-state lidar developer drew $300M — and those are just the largest rounds. Plus, new HPC architectures, GAA metrol... » read more

Startup Funding: September 2020

By Jesse Allen - 01 Oct, 2020 - Comments: 0

It was a good month for startups, with big rounds in automotive, data centers, and AI. A new startup with big backing is taking aim at energy inefficiency in the data center, and another is looking to make the industrial IoT battery-free. SK Hynix founded a new company to analyze semiconductor manufacturing data, and one of China's EV companies sees a massive cash infusion. This month, we look ... » read more

Knowledge Centers
Entities, people and technologies explored

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: PCS Holding

Startup Funding: July 2022

Startup Funding: June 2021

Startup Funding: September 2020

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