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Chip Industry Week In Review

By The SE Staff - 04 Apr, 2025 - Comments: 0

Check out our new Inside Chips podcast. President Trump’s ‘Liberation Day’ tariffs were announced this week. The executive order stated that semiconductors and copper imports are not directly subject to the reciprocal tariff, although the exemption may be short-lived. Semiconductor equipment and tools were not mentioned, leaving the industry searching for clarification. Regardless, hig... » read more

Startup Funding: Q1 2025

By Jesse Allen - 02 Apr, 2025 - Comments: 0

The first quarter of 2025 saw six companies raise at least $100 million in investment. Of those, three went to quantum hardware companies, with major investment into neutral atom, superconducting, and hybrid quantum control approaches. AI chips and enabling technology were another big winner in the quarter, with companies developing optical communications tech for chips and data center infra... » read more

Startup Funding: December 2022

By Jesse Allen - 04 Jan, 2023 - Comments: 0

The month of December saw six rounds of $100 million or more. The largest, at a massive half-billion dollars, will support manufacturing of 12-inch monocrystalline silicon polished wafers and epitaxial wafers in China. The company is aiming for a production rate of 1 million pieces a month when current expansion is completed. Also in the half-billion club last month is a company making auton... » read more

Trending Articles

Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

by The SE Staff

Three-Way Race To 3D-ICs

Intel, TSMC, and Samsung are developing a broad set of technologies and relationships that will be required for the next generation of AI chips.

Tape-Out Failures Are The Tip Of The Iceberg

As the success rate for the semiconductor industry declines, it may be time to rethink our priorities.

by Brian Bailey

Chip Industry Week in Review

TSMC's technology roadmap; Intel cuts; reciprocal hacking; McKinsey on IC challenges, ML algorithm table; subsystem chiplets; cross-domain PLM; magnetic switches; sarin sensors.

by The SE Staff

Chip Industry Week in Review

Intel's new roadmap; EU chip plan needs work; RISC-V boost; UK IC workforce study; materials and wafer shipments; on-chip PDN sensor; IoT Wi-Fi 7; new e-beam lithography facility; more earning reports; Apple's 19B chips in U.S.

by The SE Staff

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Chip Industry Week in Review

AI export rule to be scrapped; SEMI, EU request; Cadence, Nvidia supercomputer; AI co-processor; Imagination's new GPU; semi sales up; imec, TNO photonics lab; NSF key to national security; flexible packaging control system; SiConic test engineering; USB 4 support; SiC JFETS; magnetic behavior in hematite.

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Startup Funding: Q1 2025

AI chips and data center communications see big funding; 75 startups raise $2 billion.

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Advanced Packaging Fundamentals for Semiconductor Engineers

New SE eBook examines the next phase of semiconductor design, testing, and manufacturing.

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Linear Pluggable Optics Save Energy In Data Centers

New OIF electrical standards will enable interoperability, adding another option for faster and more efficient data movement.

by Bryon Moyer

Chip Architectures Becoming Much More Complex With Chiplets

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Interconnects Approach Tipping Point

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